May, 2020


www.us- tech.com


Page 13


INNOVATION IS IN OUR DNA


New innovative 3D AOI with excellent ROI


Our new S3088 DT system guarantees the highest throughput and inspection quality for high and low mix electronic assembly lines. Thanks to the unique compact design our latest innovation enables cost-effective quality assurance and dual-track operation with smallest footprint. In addition to 3D AOI tasks, configurations are available as 3D SPI, CCI or UFI. Various interfaces allow for seamless integration into a Smart Factory environment.


WINNER


3D SPI 3D AOI 3D AXI 3D MXI 3D Bond


CCI


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