search.noResults

search.searching

dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
Page 98


www.us- tech.com


September, 2019 New Modular Power Supplies from TDK


National City, CA — TDK Corporation has intro- duced the TDK-Lambda QM4 modular power sup- plies rated at 550 to 650W. This further extends the QM series which can provide up to 1,500W output power. The QM4 models are available with up to 10 outputs, have full MoPPs isolation and low acoustic noise. With medical and industrial safety certifica- tions, the power supplies are suitable for use in med- ical, test and measurement, communications, and broadcast equipment. Accepting a wide range of 90 to 264 VAC, 47 to


63 Hz input (440 Hz with reduced PFC), the QM4 can deliver 550W at low line and 650W with a high line 180 to 264 VAC input. With its modular construction, the series can be configured using a simple online configurator to provide 1 to 10 independently regulat- ed outputs and include individual output good signal and remote on/off functions.


The QM series module output voltages range


from 2.8 to 105.6V and have output power levels from 300 to 1,200W. A further subset of option modules provides an AC fail signal, standby voltages (up to


12V, 2A), global remote on/off and PMBus™ commu- nications. Overall case dimensions for the QM4 are 4.3 x 2.5 x 10.6 in. (108 x 63.3 x 270 mm). The QM4 will operate in ambient temperatures


of –4 to +158°F (–20 to +70°C) and –40°F (–40°C) start-up — with output power and output current linearly derating above 122°F (50°C) to 50 percent at 158°F (70°C). With efficiencies of up to 91 percent, less internal heat is generated, allowing the use of a low-speed cooling fan to reduce audible noise. A lower airflow speed also significantly reduces the ingress of dirt and other contaminants, improving product reliability. All models in the QM series have


a seven-year warranty as standard. Contact: TDK-Lambda Americas, Inc., 401


QM4 series modular power supply.


Mile of Cars Way, Suite 325, National City, CA 91950 % 619-575-4400 E-mail: tom.tillman@us.tdk-lambda.com Web: www.tdk-lambda.com


See at The Battery Show, Booth 2330


TECHNICA, U.S.A. Fulfilling Manufacturing Needs Throughout the Electronics Industry


ZYMET: Reworkable Edgebond and Edgefill Adhesives


East Hanover, NJ — ZYMET is now offering reworkable edgebond and edgefill adhesives, designed to increase board-level reliability of large WLPs for harsh environment applications. The company is pre- senting research findings alongside Portland State University at SMTA International 2019. WLPs, which include WLCSPs


and FO-WLPs, offer a path to lower weight, smaller form factor and high- er performance. However, their low coefficients of thermal expansion are not well matched to those of common- ly used organic substrates. This mis- match results in early solder joint fatigue and early failures in thermal cycle tests, tests that are more and more difficult to pass as the package gets larger or as conditions become more harsh. This limitation constricts the


•Fast setup & changeover •Simple operation


•Stable & reliable print process •Fine pitch printing capability •Excellent print definition


•Powerful off-Line programming •User friendly interface •Exceptional pickup reliability •100% ball & lead inspection •Optimal performance & accuracy


xcellent choice for High Mix, Medium Volume Production


user to either small package sizes or to limiting the use of such packages to less severe environments. ZYMET’s investigation shows that reworkable adhesives can enhance board-level reliability of large WLPs, even for harsh environments. Thermal cycle testing from –40


to +257°F (–40 to +125°C) was per- formed on a 0.47 in. (12 mm) WLCSP that was assembled with SAC solder on a rigid PCB. Non-bonded assem- blies were compared with those bonded with a reworkable edgebond adhesive, applied in both dot-edge- bond and full-edgebond configura- tions, and with a reworkable edgefill adhesive. The expected poor perform- ance of the non-bonded package is confirmed. All three bonded configu- rations significantly improved per- formance, raising characteristic life by 300 to 1,000 percent, depending


on the configuration. Contact: ZYMET, Inc., 7 Great


Available in the United States exclusively through Technica U.S.A.


1-800-909-8697 www.technica.com


Meadow Lane, East Hanover, NJ 07936 % 973-428-5245 E-mail: info@zymet.com Web: www.zymet.com


See at SMTAI, Booth 941


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108  |  Page 109  |  Page 110  |  Page 111  |  Page 112  |  Page 113  |  Page 114  |  Page 115  |  Page 116  |  Page 117  |  Page 118  |  Page 119  |  Page 120  |  Page 121  |  Page 122  |  Page 123  |  Page 124  |  Page 125  |  Page 126  |  Page 127  |  Page 128