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Page 68


www.us- tech.com


September, 2019


Smart Hybrid Actuators Combine Precision, Force and Travel Range


Continued from page 65


Find Electronic Failures with Vibration Testing


Benchtop Vibration Table


   


     


measuring system. The servo-algo- rithms consider the motor and the piezo system as a single drive unit and compare the actual motion with a calculated trajectory. The control principle of


the hybrid drive is not compli- cated. The motor voltage is derived from the control volt- age of the piezo. The greater this voltage, the faster the motor runs. When the piezo expands, the motor drives the drive screw in the same direc- tion. In this way, the rough positioning of the drive screw is supplemented by the fine positioning of the piezo. At the same time, the drive screw always moves the piezo near to its zero position automati- cally. This gives it the best chance of correcting the posi- tion in both directions. In this way, relatively long travel ranges can be combined with an extremely high positioning accuracy. The characteristics of


get position needs to be reached with nanometer precision. Other typical applications areas include measuring technology or surface inspection, semiconductor manufacturing, micro - s copy, and laser technology.


Depiction of a main mirror segment


from ELT, the three hybrid drives are shown in blue.


these types of hybrid drives are not only useful for telescopes, but are always a practical solution when a position needs to be detected with high precision and moved repeatedly over long travel ranges, or when a tar-


Contact us for more info.


Cincinnati Sub-Zero Cincinnati, OH


www.cszindustrial.com See at The Battery Show, Booth 321 (p) 513-772-8810 Contact: PI (Physik


Instrumente) L.P., 16 Albert Street, Auburn, MA 01501 % 508-832-3456 fax: 508-832-0506 E-mail: stefanv@pi-usa.us Web: www.pi-usa.us r


Mitigating ESD Risk in


ANSI/ESD/JEDEC JS-002-2014 standard, contain the HBM and CDM threshold classifications. When using electronic compo-


nents deemed HBM class 0B or CDM class C0b sensitive, a robust ESD


Barcode Labeling and Masking Continued from page 62


control plan is needed. That plan should consider all aspects of PCB assembly and ensure that the follow- ing three key elements are defined and resolved:


l All conductors need to be ground- ed. A charged isolated conductor can


be a dangerous risk. l


and low-charging materials. l


SCS PRECISIONCOAT V


Non-conductors (insulators) need to be replaced with static dissipative


side of ESD-protected areas (EPAs) requires static-protective materials (static-safe packaging).


Transportation of the device out-


ESD Sources: Masking Tape and Barcode Labels


Masking tape and barcode


labels play an important role in PCB assembly, but they also create the risk of an ESD event. Masking tape provides protection to components during the assembly process from flux, solder and cleaning agents. Barcode labels enable tracking


of the PCB during the assembly process. Most robust manufacturing processes collect data on the PCB during each assembly step and allow for lot tracking with a barcode. Using a label printed on-demand at the site of manufacturing offers a cost-effec- tive and flexible way to barcode the PCB.


In PCB assembly, the labels


and tapes, which are constructed of a film, adhesive, and release liner, are typically cut into small shapes. Since the PCB goes through a harsh set of conditions, including high tempera- tures and harsh chemical exposures,


See at SMTAI, Booth 808 and IMAPS, Booth 531 Continued on page 70


NEW


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