September, 2019
www.us-
tech.com
Duluth, GA — Koh Young America is offering a range of fully 3D inspec- tion solutions and its next-genera- tion, closed-loop Koh Young Process Optimizer (KPO). At SMTA Inter -
analytics eliminate false calls and boost throughput. The company is also displaying its flagship aSPIre3, with a feature set suitable for myriad challenges in demanding inline pro- duction environments. The company’s Zenith AOI sys-
tem complements its line of SPI equipment and consists of multiple models that target different produc- tion needs. The hardware technology and
measurement algorithms within the Zenith series work together to identi- fy defect sources and provide accu- rate inspection of components, joints and more, regardless of the model. Using its 3D AOI measurement
technology as the foundation, Koh Young designed its KY-P3 to over- come the industry challenges of auto- mated pin inspection. Combining high-resolution optics with vision algorithms, the KY-P3 provides accu- rate pin inspection for single-pin, array, forged, press-fit, and other pin arrangements. The KY-P3 delivers true 3D inspection capabilities for automotive, industrial and other ver- ticals, including backplanes and con- nector assembly processes. Koh Young is also making
advancements toward the smart fac- tory. KPO uses AI-powered machine learning and interlinking software modules that exercise complex algo-
Page 107 Koh Young Highlights Fully 3D Inspection Solutions
rithms to develop closed-loop process recommendations. Machine-to-machine (M2M) con -
nectivity drives the smart factory vision, enabling automatic SMT line adjustments. Working with its printer and mounter partners, Koh Young has developed the connectivity tools to connect with multiple suppliers and simplify communication across the
entire PCB line. Contact: Koh Young Americas, Inc., 1950 Evergreen Boulevard,
Suite 200, Duluth, GA 30096 % 480-403-5000 E-mail:
america@kohyoung.com Web:
www.kohyoung.com
See at SMTAI, Booth 609
national 2019, the company will be demonstrating,
Zenith 3D AOI system. reportedly,
the
industry’s fastest true 3D solder paste measurement and inspection solution. The 8030-3 SPI system and
Feinmetall: Contact Solutions for Battery Cells
San Jose, CA — Feinmetall provides contact solutions for Li-ion cell forma- tion and cell testing for cylindrical, prismatic and pouch cells. As the requirements for contact quality and current are increasing rapidly, Fein - metall has developed new contact designs for its high-current families. The high-current block, HC01,
suitable for contacting prismatic and pouch cells, allows continuous cur- rents up to 600A. It inclines 41 indi- vidually spring-loaded contact probes to guarantee multiple contact points and maximize overall current carry- ing capacity and redundancy. The core principle of this con-
tact block is the “scratch principle,” which was developed by Feinmetall. The scratch principle penetrates sur- face layers to secure low contact resistance. This avoids the occur- rence of a wetting current effect. This contact solution has been
tested and verified by an independent institute at the University of Aachen. Such a scratch contact is especially suitable for contacting Li-ion battery cells, as the typical aluminum current collector on the cathode side can be contacted safely. As aluminum tends to build oxide layers at the surface, this solves a major challenge in con- tacting those battery cells. The contact block can be
equipped with a spring-loaded sense pin for the voltage path of a four-pole measurement. An integrated spring- loaded temperature sensor allows monitoring of the heating directly at the current collector. A dedicated drill hole in the block can be used for cooling
the contact area by compressed air. Contact: Feinmetall USA, LLC,
2151 O’Toole Avenue, Suite 10, San Jose, CA 95131 % 408-432-7500 E-mail:
info.us@
feinmetall.com Web:
www.feinmetall.com
See at The Battery Show, Booth 430
Award-winning Ersa Rework Systems – Industry leading rework technologies with guided rework processes
Ersa HR 550
High-definition camera for placement and process monitoring
Computer-aided component alignment, digital split-optic
Hybrid top-side heater: 1,800 W
Full-surface 2,400 W medium wave infrared bottom heating
Ersa HR 600 XL PCB size of up to
625 x 625 mm (24.5 x 24.5 in)
Component size of up to 60 x 60 mm (2.36 x 2.36 in)
Placement accuracy: up to ±25 µm
Hybrid top-side heater: 800 W
Innovative 25 zone Matrix Heater™ (600 W each), seperately controllable
Total power of all zones combined: 15,000 watts
Kurtz Ersa, Inc. 1779 Pilgrim Road
Plymouth WI 53073 | USA Phone: +1 920 893 1779 Fax: +1 920 893 1562
rework.info@
kurtzersa.com
Kurtz Ersa México, S.A. de C.V. | Mexico Kurtz Ersa Asia Ltd. | China Ersa Hong Kong & Shanghai | China Kurtz Ersa | France
Ersa GmbH | Headquarters | Germany Kurtz Ersa Vietnam Company Ltd. | Vietnam
ww w . k u r t z e r s a . c o m
Ersa HR 600/2
Automated component placement
Automated desoldering and soldering process
Hybrid heater head with two heating zones for effective heat transfer
Extensive, powerful IR-bottom side heating cassette with 3 zones
Non-contact temperature measurement with digital sensor
See at SMTAI, Booth 424
Ask for your
rework.info@
kurtzersa.com
ONLINE DEMO
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