LEDs ♦ news digest
reliability. In power cycle testing where solder failed at 200 cycles, Henkel’s Ag sintering technology was able to reach more than 2,000 cycles before the first failure. With thermal conductivity and thermal resistance that are superior to that of solder, Ablestik SSP2000 offers better performance and reliability. For high power devices such as IGBTs, that presents tremendous latitude as compared to traditional solutions.
“Because of Ablestik SSP2000’s superior power handling performance, IGBT designers and manufacturers are now able to reduce the number of chips in a package and save on valuable device real estate,” comments Todd. “This material provides a technical solution that popular high-lead soft solders simply don’t have. What’s more, all the performance is achieved in a non-pressure process with lower curing temperatures, which is icing on the cake!”
Not only do semiconductor packaging specialists want higher throughput, higher performance materials, but are also actively seeking viable replacements to high-lead solders – particularly in the power device segment. The RoHS deadline for the elimination of lead-based materials from the power device market is currently set for 2014, which means that in less than three years suitable alternatives must be in place. For power device manufacturers, Henkel already has the solution with the first Ag sintering die attach material of its kind.
As Todd concludes, the flexibility of Henkel’s solution is simply untouchable. “The lead-free advantage, design latitude, thermal and electrical performance, reliability and high UPH capability – it’s all there. Our silver sintering technology is already proving its worth in the power device market, has shown great promise in the high power LED market and, frankly, is ideal for any application that requires high thermal capability in high volume. This will no doubt be a game-changer.”
For more information on Ablestik SSP2000, please log onto
www.henkel.com/electronics
With Ablestik SSP2000, the pressure requirement is eliminated and the material can be cured in a standard batch oven at a temperature as low as 200 degree centigrade.
Cree‘s high power LEDs illuminate Magnalight’s bar
Twenty-four Cree XLamp MC-E LEDs are used in Magnalight’s light bar which is designed for boating and sailing applications.
Magnalight is marketing the LEDPB10W-240X2E LED light bar which produces 20,640 lumens of intensely bright light output in a compact housing size.
Magnalight says its high intensity LED light bars offer excellent high lumen output coupled with low power requirements.
Unlike similar units which align 24 LEDs in a single row, resulting in a very long housing, the LEDPB10W-240X2E places LEDs in two rows of 12, resulting in the same power output from a housing that is half as long.
IP68 rated and waterproof to 3 metres, the LEDPB10W-240X2E LED light bar is designed to resist the destructive effects of salt water and the elements, and is made of extruded aluminium with an unbreakable LEXAN lens and stainless steel mounting hardware for extreme durability
August/September 2011
www.compoundsemiconductor.net 69
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