news digest ♦ Equipment and Materials
µV1 as the most suitable machine and technology for trial machining of semiconductor materials and sample production.
When photolithography or etching is used for semiconductor shaping in trial or sample production – applications in which production quantities are inherently limited and production is subject to frequent changes - these methods tend to inflate costs as they require the production of multiple masks for each modification in semiconductor shape. These methods also require long time for processing patterns in case of deep shape, and they impose limitations on 3D free-curve shape processing. MHI views machining by the µV1 as a new technology that addresses these shortcomings, and the company is aiming at additional applications such as micro flow channels required for bio-chips. To promote use of the machine in those new fields, MHI will leverage its machining knowhow and expertise to firmly support potential users in all phases from initial consideration of the µV1 through to its actual operation.
Figure:”µV1” micro milling machine
MHI has also succeeded in the machining of wafer materials made of glassy carbon and silica glass. On the revised Mohs hardness scale, which rates the hardness of a diamond at 15, SiC is rated at 13, making it the third hardest wafer material, and sapphire is a 12, the fourth hardest. Glassy carbon is rated between 10 and 11 and silica glass is a 7.
For machining of wafer materials, the µV1 uses a cutting tool made of diamond. To remove hard fine swarf mixed with coolant oil, the machine is equipped with a special fine swarf collection filter. The company’s proprietary Optical Image- type Tool Measurement System can accurately measure the position of the rotating tool end using a CCD (charge-coupled device) camera, thereby enabling real-time monitoring of tool tip position precisely. This feature lets the machine obtain tool rotation dynamic accuracy data and offset thermal displacement caused by the heat generated by the machine itself, ensuring precise cutting of grooves with 1µm level accuracy.
The µV1 was released in 2006 as a three-axis milling machine for machining of precise die and mould, electrodes as well as precision parts. In 2008, a five-axis model, which has table tilting function with rotary axes, was added to the series. To date applications of the µV1 have been expanded to include machining of nonferrous materials and production of small-sized jigs.
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www.compoundsemiconductor.net August/September 2011
Imtec introduces stand alone and integration ready vapour dryers
Both IPA Accudry models are suitable for processing compound semiconductor wafers as well as solar cells and leaves them spotless and free from watermarks.
Imtec’s line of Accudry surface tension gradient dryers include both stand alone and integration ready models which are available for end users and OEM customers.
Figure: The Accudry Dryer - A surface tension IPA vapour dryer that yields substrates; wafers, integrated circuits, solar cells, fuel cells, MEMS, and disk drives, spotless and watermark-free.
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