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Fast Objective Focusing Devices from PI
Auburn, MA — PI (Physik Instrumente) LP offers a large vari- ety of piezo-driven precision position- ers for high resolution microscope applications. Piezo-driven fast nanofocus devices not only provide nanometer precise focus control, but they are also used in 3-D imaging and Z-stack image acquisition because of their rapid, millisecond- range settling speed. Several devices are available to match dif- ferent objective sizes and weights. Travel ranges from 50µm to 2mm are available. Instead of moving the objective
lens, the sample can also be posi- tioned. The PInano® stage family consists of more than 10 models of XY, XYZ and Z positioners with a variety of travel ranges, apertures (for slides, well plates and petri dishes), and feedback sensors to suit any need from focusing to high speed 3-dimensional tracking. Several stages with long travel
ranges to 100mm and more, based on ultrasonic-ceramic piezo linear motors, are available for “coarse” positioning with resolution in the 100 nanometer range. Due to their self- locking properties at rest, they reportedly provide better long-term stability than conventional motor/ lead-screw stages. The ultrasonic
motors also provide very high speed to 100mm/sec and more. High-speed piezo tip/tilt and
beam steering devices scan laser beams in two coplanar axes avoiding polarization rotation errors typically induced by stacked single galvo scan- ners. A variety of single and multi-
June, 2013
Cree: 2nd Gen SiC MOSFETs for Power Conversion Systems
Durham, NC — Cree, Inc. has intro- duced its second generation SiC MOSFET enabling systems to have higher efficiency and smaller size at cost parity with silicon-based solu- tions. These new 1200V MOSFETs deliver highest power density and switching efficiency at half the cost per amp of the company’s previous generation of MOSFETs. At this price-performance point, they enable lower system costs for OEMs and provide additional savings to the end-user through increased efficien- cy and lower installation costs due to the lower size and weight of SiC- based systems. According to the company, eval-
Fast objective focusing devices.
axis piezo controllers for laboratory use and OEMs are offered. The con- trollers are compatible with leading imaging software platforms such as Metamorph® and µManager. Lab - View® and MATLAB® drivers are
also available. Contact: PI (Physik
Instrumente) L.P., 16 Albert St.,
Auburn, MA 01501 % 508-832-3456 fax: 508-832-0506 E-mail:
info@pi-usa.us Web:
www.pi-usa.us
UnPlug! Automate
your process. Not your
inspiration.
uation of the new devices by the Fraunhofer Institute in Freiburg, Germany has revealed state-of-the- art efficiency, enab ling system opera- tion at higher switching frequencies that result in smaller passive compo- nents, especially smaller inductors. This substantially improves the cost- performance tradeoff in solar invert- ers in favor of smaller, lighter and more efficient systems. The superior performance of
these new SiC MOSFETs enables the reduction of required current ratings by 50 to 70 percent in some high power applications. When properly optimized, customers can now obtain the performance benefits of SiC with the same or lower systems cost as with previous silicon solutions. For solar inverters and uninter-
ruptible power supply (UPS) systems, the efficiency improvement is accom- panied by size and weight reductions. In motor drive applications the power
density can be more than doubled while increasing efficiency and provid- ing up to twice the maximum torque of similarly rated silicon solutions. The product offering range has
been extended to include a much larg- er 25mW die aimed at the higher power module market for power levels above 30kW. The 80mW device is intended as a lower cost, higher per- formance upgrade to the first genera- tion MOSFET.
New generation of SiC MOSFET devices.
25mW, intended as a 50Amp building block for high power modules, and 80mW. The 80mW MOSFET in a TO- 247 package is intended as a higher performance, lower cost replacement for the company’s first-generation CMF20120D. Packaged parts are available immediately from DigiKey,
Die are available with ratings of
Mouser and Farnell. Contact: Cree, Inc., 4600 Silicon
Drive, Durham, NC 27703 % 800-533-2583 or 919-313-5300
fax: 919-313-5558 Web:
www.cree.com
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