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www.us-tech.com
Partnering June, 2013 Enhancing Solder, Stencil, and Assembly By the staff of FCT Assembly
and leaded solder products, superior quality stencils, and precision cut parts. The company consists of three divisions: FCT Solder, Fine Line Stencil, and A-Laser. With numerous facilities in the United States, the company sets itself apart from its competitors by continuously study- ing new products and processes in order to uphold its reputation as a leader in technology. Customers rely on FCT for the latest technology and for products with the highest quality. FCT maintains a leading-edge repu- tation with its customers through the efforts of hard-working field applica- tion engineers.
H
Field Application Engineer The role of a field application
engineer encompasses technical service as well as research and devel- opment (R&D) activities. For exam- ple, a field application engineer works with customers to help set up processes in order to run products with success while also performing R&D work. For FCT Assembly, such
eadquartered in Greeley, CO, FCT Assembly is an impor- tant manufacturer of lead-free
R&D is performed on its solder paste and stencil products in its solder paste testing laboratory. The work involves researching new product formulations and improving existing formulations. In addition, field appli- cation engineers fine-tune process parameters for products and perform some laboratory troubleshooting. An- other part of the field application en- gineer’s responsibilities include writ- ing and improving technical litera- ture. They directly benefit customers by helping find solutions to their problems and applying those solu- tions to their processes. And cus- tomers will benefit from the en- hanced performance of products that continue to improve. Tony Lentz is FCT’s newest
field application engineer. He began with FCT Companies in 1999 as its only laboratory person. He became laboratory manager as the company hired laboratory technicians. He of- fers a great deal of experience, ac- complishing everything in the labo- ratory from quality control (QC) to customer service and R&D for all FCT Companies. Over the last year and one-half, he worked as the facili-
ty manager of the Greeley, CO man- ufacturing facility where he oversaw all personnel and processes in that facility. His background in chem- istry, along with years of laboratory experience and technical service work, has prepared him for his new role as field application engineer.
Early Focus Early on, most of the
company’s focus was on wet chemical and solder products used to make bare printed cir- cuit boards (PCBs). The firm has since expanded its prod- uct lines and the industries that it serves to include wastewater treatment and power-plant chemistries (FCT Water) and solder paste, flux- es, stencils, and part cutting (FCT Assembly). The compa- ny is also making inroads in Asia through its sister compa- ny FCT Asia. Over the years, Lentz has performed a signif- icant amount of onsite techni- cal service work and laborato- ry troubleshooting for the company’s customers. Lentz has worked in the
still use lead-bearing materials, but they also have added lead-free capa- bilities. This has caused the changes driven by RoHS and REACH to be in- corporated slowly and will likely will continue over many years. Looking to the future, Lentz be-
lieves that electronic devices will continue their trend to grow even smaller and to gain greater function-
REFLOW SOLDERING SYSTEMS
CONDUCTION + CONVECTION HEAT
Reflow Soldering & Curing Applications include:
• BGA Reballing • BGA Packaging Falcon 5/C • Die/Heat Sink Bonding
• High Density Packaging/Substrates • Laminated Power Components
• Laser Diode Reflow • Lead Frames • Microwave Hybrids, Fluxless Au/Sn Reflow • Extremely Low O2 ppm Capability w/low N2 Consumption SIKAMA INTERNATIONAL, Inc. 118 E. Gutierrez Street • Santa Barbara, CA 93101-2314 U.S.A. Tel: 1-805-962-1000 • Fax: 1-805-962-6100 •
sales@sikama.com •
www.sikama.com
electronics industry since 1994, gathering experience and knowledge that he now uses to help strengthen FCT Assembly. His initial work in the electronics indus- try was as a process engineer at a printed-wire-board (PWB) manufac- turer called NTI, which was later ac- quired and became part of DDI. He notes: “I learned quite a bit about set- ting up processes and fine tuning pa- rameters through hands-on engi- neering. I worked with our ISO 9001 quality system and became very fa- miliar with it. That experience en- abled me to bring additional process engineering and quality control sys- tems to FCT Companies, which led to my role as laboratory manager.”
Field Application Engineer Tony Lentz cleaning and inspecting a stencil after screen printing with solder paste.
ality. Mobile telephones and comput- ing devices will continue to pack more power into smaller packages. These trends will drive manufactur- ers to improve their processes and suppliers to improve their materials. RoHS and REACH regulations and others like them will continue to ex- pand their coverage, causing a shift in the materials used. This will cre- ate challenges for manufacturers and suppliers alike. High-volume produc- tion will continue in Asia, and North American manufacturers will be- come more focused on quick-turn pro- totyping. As for the different FCT Compa-
The Changing Playing Field Reflecting on when he first en-
tered the industry in 1994, Lentz points out some significant changes: “Technology definitely has improved since 1994. Electronic devices can do so much more today than they could at that time. This improvement in electronics has increased the complex- ity and the difficulty of building cir- cuit boards. This has created a state of constant improvement for most elec- tronics manufacturers. Some are al- ways ‘pushing the envelope,’ trying to build that next new device.” He feels that two of the most
significant changes that are still in flux today are the implementation of RoHS and REACH requirements. Many companies supply products with lead and the other restricted substances due to customer require- ments or because of exemptions for certain products and industries. Bare board manufacturers and assemblers
nies, he foresees growth and expan- sion. FCT Assembly is dedicated to ex- panding the solder, stencil, and parts divisions. Fine Line Stencil has un- dergone recent growth through acqui- sitions, and this trend will likely con- tinue. Currently, there is some excit- ing R&D work with stencil coatings that could provide significant cus- tomer benefits. A-Laser constantly looks for ways to expand its offerings by cutting new materials and selling into new industries. Also, parts etch- ing capabilities will be added in the near future. FCT Solder will continue to promote and expand its product lines of solder pastes, fluxes, and bar solder, with most of its focus on its sol- der paste products. In addition, it is expanding sales in Asia through its
sister company FCT Asia. Contact: FCT Assembly, 1309
North 17th Ave., Greeley, CO 80631 % 970-346-8002 E-mail:
tlentz@fctassembly.com Web:
www.fctassembly.com r
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