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June, 2013


www.us-tech.com


Feldkirchen, Germany — MatriX Technologies has introduced its new X3L in-line X-ray inspection system in the USA. The X3L configuration is avail- able with an innovative dual detector concept, combining a linescan for transmission inspection of complete PCBs in a few seconds as well as a high resolution digital flat-panel for selective 3D image capturing. 3D X-Ray technology is especially useful for


double-sided solder joint inspection of PCB assem- blies. The key application in SMT production is to focus on hidden solder joints, especially head-in- pillow defects for BGAs and cold solder joint analy- sis for QFN components. Other important inspec- tion tasks are thermal pads and PTH/THT barrel fill measurements per IPC-610 requirements. The new X3L system offers a combination of


optimized test concepts — transmission, off-axis image capturing, and 3D-SART — that selectively uses the 3D technique where it is re- ally needed. Typically, 80 percent of the solder joints on double-sided boards can receive sufficient inspec- tion by using transmission X-ray. Be- cause the X3L inspection system uses a high-speed readout TDI camera (line scanner) in parallel, it reduces the image capture process for 18 x 16-


New Teknek PCB Cleaner Works on the Line to Cut Down Defects


Inchinnan, Scotland — Some 74 per cent of all defects in the PCB manu- facturing process are related to sol- der paste problems according to the SMTA. Blocked stencils can be caused by a number of things includ- ing laser marking ablation dust, smaller apertures in the stencil and even hair and clothing fibers from operators. The latest addition to Teknek’s family of SMT “Clean Ma- chines” — the BC 460 — is a single- sided board cleaner capable of clean- ing boards up to 460mm wide and in- tegrates seamlessly into the produc- tion line. The unit also incorporates an


anti-static system to reduce the risk of recontamination and is easy to op- erate using an icon-based operator interface. In addition, the use of in- dependent motors to drive each roller has reduced the number of moving parts, which will increase long-term reliability. Contact cleaning was pioneered


by Teknek 20 years ago and the com- pany has remained at the forefront of the technology and innovations in this field ever since. The technology uses a unique elastomer roller to gently lift dry, unattached particles (down to one micron in size) from the surface being cleaned. The contami- nation is then transferred to a re- serve-wound pre-sheeted roll of ad- hesive for disposal. This has been proven to be the most effective method of contamination elimination for critical processes as the roller makes direct contact with the sub- strate without damaging it. The key benefits of contact cleaning are in- creased yields, improved quality and


reduced waste. Contact: Teknek, River Drive, Inchinnan Business Park, Inchin-


nan, PA4 9RT, Scotland, UK % +44 (0) 141 568 8100 Web: www.teknek.com


In-line 3D X-ray inspection system.


in. (457 x 406mm) PCBs to less than 10 seconds. This approach enables the user to select the opti-


Page 41 Hi Speed 3D In-line X-Ray from MatriX Technologies


mum inspection technique based on individual re- quirements. Each X3 system is equipped with the newly


developed 3D-SART (Simultaneous Algebraic Re- construction Technique), which provides slice im- ages for high quality solder joint analysis. 3D- SART generates detailed, high-resolution images for a reliable analysis based on a minimum amount of projections. The new X3 series uses the well-established


MIPS platform with links to all MIPS software modules for programming, classifying and verifica- tion. MIPS verify now supports the defect image


verification with an extended 3D functionality. Contact: MatriX Technologies GmbH, Dor-


nacher Strasse 5, 85622 Feldkirchen, Germany % 0049 89-189 41 40-14 fax: 0049 89-189 41 40-98


E-mail: christina.heil@m-xt.com Web: www.m-xt.com


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