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www.us-tech.com


June, 2013 LED Signage and Display Kit from JKL


Pacoima, CA — New from JKL Com- ponents Corporation its LED Sig- nage and Display Kit —Part Number SK14.


The kIt includes a full selection


of LED technologies appropriate for use in the signage, display, gaming and architectural industries. These kits are excellent for product devel- opment of backlit signs, under-cabi- net lighting, display, retail and mu- seum case lighting as well as for ar- chitectural remodeling. The SK14 LED Kit allows the


designer to test an array of LED de- signs that vary in intensity, design,


LED pitch and color. Having these materials on hand allows for rapid design creation, quick prototyping and shortens the time from develop- ment to market. The kit also serves as a valuable sales tool for craftsmen and designers to showcase lighting options for potential clients to turn quotes around faster and ultimately capture more business. The comprehensive kit comes


complete with 12 and 24V adapters, 23 Linear LED options, five varieties of channel lights, an assortment of based LEDs along with sockets, join- ing connectors and mounting acces-


sories, including an LED-compatible dimmer. The kit includes two linear chip-on-board (COB) ZLP LED Lights, excellent for high brightness needs for compact designs. The kit comes in a convenient canvas bag that includes 11-in. (279mm) zip pockets organized by product type and operating voltage. Available through the compa-


ny’s website, the price of the SK14 is $225 and all specifications, user sheets, installation instructions and technical information are included in printed form as well as on a USB thumb drive.


LED installation and presentation kit.


Finally, a Pb-free solder paste that takes a shine to ENIG/gold PC boards.


Introducing NC-560-LF, the Pb-free no-clean solder paste designed for hard-to-solder metallization surfaces


Nothing increases production yields like AMTECH’s NC-560-LF, the lead-free, no-clean solder paste for hard-to-solder metallization surfaces, including ENIG (Gold),OSP, HASL and immersion silver boards.This fully RoHS-compliant solder paste delivers unparalleled lot-to-lot and stencil printing consistency, and enhanced solderability due to superior print performance characteristics, including excellent wetting and activity, ideal viscosity, long stencil life, thermal stability up to 300


o C, and minimal residue. NC-560-LF


solder paste is also low beading, low voiding, and anti-tombstoning to reduce scrap and rework. Looking to strike it rich with greater hourly throughput? CallAMTECH today, and you’ll be golden.


AMTECH www.amtechsolder.com  


  


 FI LLI NG TH E VO ID


Contact: JKL Components Cor- poration, 13343 Paxton Street, Pa-


coima, CA 91331 % 818-896-0019 fax: 818-897-3056 E-mail sales@jkllamps.com Web: www.jkllamps.com


Low-Melting Tin/Bismuth Paste Newly Developed by FCT Assembly


Greeley, CO —FCT Assembly has de- veloped a new low-melting Tin/Bis- muth solder paste — NC722. The new no-clean solder paste is a new- generation halide-free, rosin-based chemistry designed to provide a pre- viously unseen level of repeatability and consistency to the printing process.


Low temp melting solder paste. The paste is designed to be used


with low-temperature alloys such as Sn42/Bi58. The paste offers an excel- lent open time, extended abandon time and good soldering activity with all surface finishes. In addition, it meets or exceeds the requirements for ANSI/J-STD -004, -005 as well as all Bellcore test criteria for solder pastes. Residues left behind are clear and maintain a virtually indefinite pin probability life. Paste attributes include a wide


reflow window with good solderabili- ty on various PCB surface finishes and unlimited pin probability and clear post-process residues. The paste exhibits excellent print volume consistency with surface area ratios (SAR) as low as 0.55 when used with the UltraSlic™ stencil technology. In addition, the non-hygroscopic, low voiding/high-reliability formulation


is suitable for high RH areas. Contact: FCT Assembly, 1309


North 17th Ave., Greeley, CO 80631 % 970-346-8002


E-mail: support@fctassembly.com Web: www.fctassembly.com


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