Page 52
www.us-tech.com
Is This the Right Way to Eliminate Counterfeits? Continued from page 50
their sales channels. l
der security to reduce importation. Re-marking components with
Government needs to enhance bor-
the DNA is considered to be “rework- ing,” which ends up placing the ICs in a different batch, and usually in the hands of a subcontractor. Under NDAA 818 all contractors are re - quired to guarantee that they do not have counterfeits in their systems and must pass this re - quirement down to their subcontractors in their purchase contracts. Any rework or replacement cost is paid by the con- tractor, and of course, the added cost is passed along to the DoD. This implies that the contractor has extensive liability or responsibility in the event of a system failure caused by counterfeits, and this is beyond what govern- ment contractors usually have to concern them- selves with. For example, what happens if it is proven a life is lost or a $50 million plane crashes because of counterfeit product? There is serious risk to the contractor if it is determined a coun- terfeit had possibly been at fault.
DLA DNA Mandate The conference also focused on
the November 15, 2012, DLA Man - date that all 5962 integrated circuits purchased by DLA must be marked with DNA tracers purchased from Applied DNA Sciences. Most 5962
manufacturers are not capable of marking product for DLA with DNA ink because of their required product flows, which means that most prod- uct purchased by DLA will be coming from brokers and third party distrib- utors who are able to mark the parts with the Applied DNA Sciences-sup- plied ink then resell it to the DLA. As is apparent from these
selected topics, The DMSMS and Standardization Conference was
lowering the number of available suppliers. The conference wasn’t just talk-
ing more about counterfeits. The exhibitor booths offering anti-coun- terfeit services outnumbered those of the manufacturers of DMS products and services. Considering the growth of counterfeits, it appears certain that this trend will continue. The DLA’s intention of requir-
ing DNA marking to reduce counter- feits will probably fail in achieving its goal of eliminating the counterfeit problem. The DNA marking, as intended, will only insure the IC was manufactured or resold by a known distributor, broker or manufacturer. As such, DNA marking cannot
insure that the device was handled properly from the time of manufac- ture to its sale to DLA. The product could be one that had been pulled from recycled PC boards, probably stored and handled without certified ESD procedures (which could cause electrical overstress), or even modi- fied after the time of manufacture.
Authenticity Not Equal to Quality In the automotive world, junk
ICs, assemblies and hybrids come in all sizes and shapes, and so do the counterfeits.
apparently less concerned about diminishing manufacturing sources and more about counterfeits. The counterfeit problem is not only increasing, with a 15 percent growth rate, but it’s becoming more impor- tant to government contractors to avoid counterfeits, due to liability issues, and more costly to the govern- ment, since DNA tracers are expen- sive and add to the lead time while
yards may sell authentic Ford parts, but the customer usually realizes that buying the used part means acceptance of the risk associated with buying it. In the world of coun- terfeit electronics suppliers, sellers are not so forthright. It is imperative that the chain of custody of ICs from manufacture to actual implementa- tion is absolutely documented, ensur- ing that the product was handled according to military and good com- mercial practices. However, the DNA marking will not communicate the
June, 2013
IC’s chain of custody after manufac- ture or distributor resale. The IC manufacturers are not
supporting the DNA marking man- date, mainly because of the difficulty of implementing the process of mark- ing them and the reality that many parts are laser marked in production now. If this trend continues, the DLA will be forced to purchase ICs that have DNA that has been applied by
Safety packaging as used for off-the-shelf drugs
could go a long way toward mitigating the counterfeit problem.
DLA-certified distributors and bro- kers — third party suppliers who will buy product from the manufacturer and then add DNA marking.
Voiding Manufacturer Warranties
This process of additional DNA
marking voids the manufacturer warranties and ultimately the device is not considered new and unused according to JEDEC standard JESD 31. JEDEC standards require the part number be changed to indicate that the device was modified after it was manufactured. This is the nor- mal process used by authorized dis- tributors when ICs have additional processes such as solder dip or pro- gramming.
Furthermore, the brokers can-
not mark the product with DNA marking and then use the same part number to sell to DLA, because this
Continued on page 54 DIE CUTTING AND GASKET FABRICATION
Rubber Seals and Gaskets for Demanding Applications
Die Cut Acoustical Foams for Sound Attenuation
Die Cut Thermal Foam Insulation
Die Cut Electrical Insulation From Ul94 Flame Retardant Polypropylene
With a state of the art facility and a global presence, Interstate’s unique collaborative customer focused approach and highly experienced team of experts gives personalized attention to your company’s unique problem and works with you to deliver the right solutions every time with exceptional quality.
SEE INTERSTATE
55 Gilmore Drive Sutton MA 01590 USA
ISO 9001:2008 and ISO 13485:2003 IN ACTION See at Atlantic Design and Mfg. Booth 4645
Tel: 800-984-1811
sales@interstatesp.com www.interstatesp.com
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92