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www.us-tech.com


Hi-Performance BGA Socket From Ironwood


Burnsville, MN — Ironwood Electronics has introduced a new high performance BGA socket prod- uct line using a special elastomer that is capable of high speed, low inductance, high endurance and


axial flow fan. The contact resistance is typically 15 milliohms per pin. The socket connects all pins with 40GHz bandwidth on all connections. The socket is mounted on the


target PCB with no soldering, and uses the industry’s small- est footprint (only 2.5mm more on each side). The socket is constructed with shoulder screw and swivel lid which incorpo- rates a quick insertion method so that ICs can be changed out quickly. The SM-BGA-9000


Hi-performance BGA socket.


wide temperature applications. The SM-BGA-9000 socket is designed for 23 x 23mm package size and oper- ates at bandwidths up to 40GHz with less than 1dB of insertion loss. The socket is designed to dissi-


pate 4.5 watts with heat sink com- pression screw and can be cus- tomized up to 100 watts with modi- fied fin design and by adding an


socket is constructed with a high performance and low inductance elas- tomer contactor. The temperature range is -55 to +150°C. The pin self- inductance is 0.10nH and mutual inductance of 0.007nH. Capacitance to ground is 0.069pF. Cur - rent capacity is 4amps per pin. The socket will work with ICs such as STM’s PBGA, 23 x 23mm with 27 x 27 array and


0.8mm pitch. Contact: Ironwood Electronics,


Inc., 11351 Rupp Dr., Suite 400, Burnsville, MN 55337 % 800-404-0204 or 952-229-8200 fax: 651-452-8400 E-mail: info@ironwoodelectronics.com Web: www.ironwoodelectronics.com


See at Semicon West Booth 5477.


July, 2011


SPEA: Mixed Signal Test Platform


Volpiano, Italy — SPEA is showing its innovative semiconductor test solutions. Its Comptest MX test plat- form addresses the test require- ments of all mixed signal devices, including power and discretes, MEMS and sensors, power manage- ment ICs, automotive devices, light- ing ICs and LED drivers, audio and video ICs, identification ICs and smart card modules. The Comptest MX has been


expressly designed to drive down the cost of test of such devices up to 50 percent, through a high-efficiency architecture that provides true per- pin architecture that achieves 99 percent parallel test efficiency in multi-die testing. The timing for the instrument


programming is generated in paral- lel by multiple, high-frequency CPUs, that are designed by SPEA, and it is independent from the PC performance. 64-line Synchrobus and 16-line high-speed Synchrobus provide a hardware synchronization between all the instruments, for a substantial test time saving. There are 88 slots for analog and mixed- signal instrumentation, and 1408 analog/digital channels, to give high multi-site test capabilities. Fast test program development and pattern- based test programming save the 30 percent on test time, compared to software-based linear programming. Real parallel test is performed


with programmable logic units for each pin, timing measurement units per pin, multiple channel digitizers with DSP instrumentation for fast


data computation, arbitrary signal generator units for the multiple sig- nal generation and possibility to install low-value measurement in - stru ments with resolution as low as 3 femtoAmps. The system is especially useful in testing power analog, smart card modules and MEMS devices. The system’s power configura- tions offer special performance in the


Comptest MX test platform.


production test of power devices with up to 16 multi-die testing; up to 1000 Amperes, ±2500V; AC/DC test capa- bilities, for wafer and final test, on a single tester; dedicated CPU on HV/HI instruments and local set-up memory, for easier management of parallel function and shorter test time; automatic spike detection to avoid damage on the DUT; embed- ded alarms on the instruments; cur- rent generators are internally paral- lelable, while voltage generators are internally stackable — meaning no need for hardware on the loadboard. Contact: SPEA America, 2609


SSW Loop 323, Tyler, TX 75701 % 903-595-4433 fax: 903-595-5003 E-mail: sales@speaamerica.com Web: www.spea.com


See at Semicon West Booth 6285.


See us at Semicon West Booth 6148 North


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