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www.us-tech.com
July, 2011 Sikama: New Oven for Wafer Bumping
Santa Barbara, CA — Sikama International, Inc. has released its newest reflow solder/curing oven — the Ultra Profile 1200. The new oven is a multi-purpose, continuous flow, reflow and curing oven capable of temperatures up to 400°C and atmos- phere levels as low as 10ppm O2
. The new unit extends the com-
pany’s offering of 300mm ovens with the addition of this bottom conduc- tion, top convection oven. With eight work zones internal to the oven — six heat zones and two cooling zones — the oven is capable of a wide vari- ety of processes. This versatile oven can be used in solder reflow applica- tions from 300mm 10µm wafer bumping to 5kg microwave power modules as well as for epoxy curing. The oven’s “Walking Beam” trans-
port mechanism is designed to move even the heaviest of these work
items from zone-to-zone through the oven with ease.
The company’s ovens
are well known in the wafer bump industry and the factory has already received orders from two major wafer fabs and an LED chip manufacturer for this newest member of its oven lineup. Incorporating the
Oven for wafer bumping.
company’s Falcon ICS 412 Flux Coater with the Ultra Profile 1200 creates a system capable of pro- cessing 6 to 12-in. wafers (flux and reflow) in a multi-zone, in-line system with a small 1.2 x 5.7 meter footprint.
Solder Bump Reballing System for CSP and BGA
SB2 -M
Solder Bump Rework System Exceptional Features • High-speed solder jetting for lead-free, eutectic SnPb, high lead, and AuSn.
• Rapid solder removal (optional) • High solder joint reliability due to low IMC growth through short laser reflow
• Tin whisker control • Solder ball sizes: 150µm and higher • Wafer-level CSP and BGA substrates
Visit us at SemiconWest North Hall Booth 5577
ISO 9000 Certified
328 Martin Avenue • Santa Clara, CA 95050 T: 408-588-1925 • F: 408-588-1927 • Email:
Sales@PacTech-USA.com www.pactech.com See us at Semicon West Booth 5577 North automated solutions, Inc.
• Micro-Spot Welding • Compacting • Splicing • Contact Welding
• Resistance Brazing • Terminal Welding • Automation • Resistance Welding
• Laser Welding • Stamping/Bending • Controllers • Inverters
Positive cavity displacement dispensing.
used with other robots or tabletop operations with an easy-to-use table- top controller. Viscous fluids are delivered to
the substrate via luer nozzles and performance excels when using GPD Global “S” Taper tips. The metering technique is not affected by varia- tions in temperature or reservoir pressure, thereby improving day-to- day and start-to-finish process results.
The company’s enhanced flow
rate luer dispense tips offer higher flow rates than standard luer nozzles with a much lower pressure build-up. GPD is also displaying the PCD
Technology on its MAX Series plat- form. MAX Series dispensing sys- tems offer high accuracy, precision dispensing over a wide range of applications. The MAX Series plat- forms are suitable for die attach, underfill, MEMS, micro-volume con- ductive adhesive and paste applica- tions.
39 Scenic View Drive • Deep River, CT 06517
Phone: Fax:
automated solutions, Inc.
Internet: Email:
860-227-0683 860-526-9296
www.strunk.de
www.strunk-connect.com info@strunk.de
Contact: GPD Global, 611
Hollingsworth Street, Grand Junction, CO 81505 % 800-742-5473 or 970-245-0408 fax: 970-245-9674 E-mail:
request@gpd-global.com Web:
www.gpd-global.com
See at Semicon West Booth 6186.
Contact: Sikama International,
118 E. Gutierrez St., Santa Barbara, CA 93101 % 805-962-1000 fax: 805-962-6100 E-mail:
sales@sikama.com Web:
www.sikama.com
See at Semicon West Booth 6060.
GPD Global Shows PCD Technology
Grand Junction, CO — GPD Global is showing its award-winning Positive Cavity Displacement (PCD) Dispen - sing system which reportedly pro- vides next-generation volumetric dis- pensing and is compatible with mate- rials used in electronics assembly such as epoxies, thermal greases, underfills, oils, silicones and UV encapsulants, as well as materials outside of the electronics industry. PCD Technology is designed for GPD Global platforms and may be
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