July, 2011
www.us-tech.com
Page 23
Research Triangle Park, NC — DuPont Microcircuit Materials (MCM) is accelerating the comple- tion of a breakthrough technology innovation that is enabling the com- pany to develop formulations for a new series of its leading DuPont™ Solamet®
brand photovoltaic (PV)
metallization pastes that significant- ly reduce the silver content. This
DuPont: New Lower-Silver PV Paste
much as 20 percent compared to today’s existing products. The devel- opment is part of MCM’s roadmap of proposed technology options to enable the industry goal for conver- sion efficiency of crystalline silicon (c-Si) solar cells beyond 20 percent by 2012, and to help lower the cost of PV generated energy. According to the company, it is
working aggressively to reduce cus- tomer reliance on silver as a basic conductive material, to reduce cell and module costs today and enable a more stable cost structure in the future. DuPont Solamet PV17A, launched at SNEC in February,
reportedly already substantially reduces the amount of paste needed to produce a solar cell, and the com- pany continues to put its science to work by lowering the silver content in the paste itself with this anticipat- ed new product system. MCM has a history of success
in enabling cost reductions through new material innovations without compromising performance. We are looking forward to introducing this system to the market.? The lower- silver photovoltaic metallization paste system is comprised of new frontside silver and tabbing pastes, which the company anticipates will
be near drop-in replacements for many applications. MCM has introduced several
new Solamet products this year and continues to focus on accelerated product development programs that help lower costs and raise efficiency, and capacity expansions to support the fast growing PV industry. Contact: DuPont Circuit &
Packaging Materials, 14TW Alexander Drive, Research Triangle Park, NC 27709 % 800-243-2143 fax: 570-268-3699 Web:
http://mcm.dupont.com
See at Semicon West Booth 2523
Solder paste with lower silver content.
development will help offset some of the impact that rising silver prices have on the cost of producing solar cells and modules. DuPont expects to commercial-
ize the first generation of lower silver Solamet pastes later this year, and based on preliminary MCM lab eval- uations, the company anticipates that the first generation products will have a reduced silver content of over 10 percent. The company expects that ongoing research efforts will enable the development of subse- quent generations of the products with the silver content reduced by as
Probes Stamford, CT — Omega’s new M12 series thermocouple sensors include a variety of metric and NPT mount- ing thread options, as well as conven- ient M12 connectors. The M12 con- nectors include thermocouple com- pensated pins in Type J and Type K calibrations. The sensors are available with
Type J, 316 stainless steel, or Type K, Inconel 600 sheaths, ungrounded junctions, and a variety of metric and imperial diameters and lengths. The
Omega Intros Thermocouple
Thermocouple probes.
M12 connectors have a temperature range of -50 to +90°C, and are rated to IP67. Contact: Omega Engineering,
Inc., One Omega Drive, Stamford, CT 06907 % 203-359-1660 fax: 203- 359-7700 Web:
www.omega.com
See at Semicon West Booth 6076.
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