July, 2011
www.us-tech.com
Sonoscan: Double Throughput 300mm Wafer Scanner
Elk Grove Village, IL — Sonoscan has begun shipping its automated 300mm bonded wafer inspection sys- tem that simultaneously scans two wafers and gives users double the throughput of other systems. The system inspects wafer pairs
intended for SOI, MEMS and other applications for 300 and 200mm wafers, and bonded by virtually any method. It images disbonds, delamina- tions, voids and particles at the bond interface, and cracks at any depth. Based on the company’s C- SAM® acoustic microscope systems,
the AW300™ also automates the entire inspection system from carrier attachment and wafer selection through aligning and acoustic imag- ing to drying and sorting. A robotic arm feeds wafers from
two load ports that accept either FOUP or FSOB carriers. Wafers are fed into either of two scanners.
ECT Set to Showcase ZIP Family Pogo Pins
Pomona, CA — Everett Charles Technologies (ECT) Contact Products Group (CPG) is showcasing the latest additions to its ZIP®
family of flat technology Pogo® pins. A new eight-
page ZIP Product Portfolio brochure also is available. ZIP was recently granted US Patent Number 7,862,391.
Twin robotic arms scan two bonded wafer pairs simultaneously.
To ensure maxi-
mum throughput, wafers are se quen ced in a stag- ing area where they are processed and temporari- ly stored. The unit uses Sono -
scan-made transducers (lenses) ranging from 100 to 400MHz. All of the UHF transducers are designed, manufactured and matched in-house to ensure optimum per- formance. The system is capable of imaging inter- wafer voids as small as 5µ wide, and delaminations
as thin as 100 Angstroms. Scanning employs the company’s non-immer- sion Water fall™ transducers and vac- uum-assisted stages. Analysis software automatically
measures the percentage of bonded and unbonded interface between the two wafers, and the sizes and num- ber of voids. Accept/reject decisions are made automatically according to the user’s specific criteria. Contact: Sonoscan, Inc., 2149
E. Pratt Blvd., Elk Grove Village, IL 60007 % 847-437-6400 fax: 847-437- 1550 E-mail:
info@sonoscan.com Web:
www.sonoscan.com
See at Semicon West Booth 5767.
Page 65
ZIP pogo pins. The ZIP Long-Travel was devel-
oped for contacting large devices and strip tests where planarity and com- pliance are an issue. It is being released in 0.40, 0.50 and 0.80mm versions. With minimal time and cost, the Z3 Long Travel Series can be supplied in different Overall Lengths (OAL): 0.40mm pitch from 3.47 to 6.83mm; 0.50mm pitch from 4.23 to 6.70mm; 0.80mm pitch from 4.48 to 7.07mm. The ZIP SCRUB pin has a posi-
tive scrub-action pad and ball contact on lead-free plated array, and periph- eral devices where solder transfer causes frequent cleaning and mainte- nance cycles. The ZIP patented 2D design has
planar contact surfaces fabricated by a unique manufacturing process, delivering performance and cost advantages. Contact: Everett Charles Tech -
nologies, 700 E. Harrison Ave., Pomona, CA 91767 % 909-625-5551 Web:
www.ectinfo.com
See at Semicon West Booth 5670.
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88