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SEMICON WEST AND INTERSOLAR
PRODUCT PREVIEW Goepel & SPEA Integrate Boundary Scan into new Flying Prober
Volpiano, Italy — Goepel electronic and SPEA have jointly developed a professional Boundary Scan option for the SPEA 4060 Flying Prober test system. This integration provides crucial benefits such as increased test and fault coverage as well as sig- nificant time savings in the automat- ed production process. The interaction between Flying
Prober and Boundary Scan is auto- matically controlled, and integrates the top and bottom probes of the SPEA system in the test run. The Boundary Scan cells are connected with the 4060 Flying Prober’s digital channels through the test points. During the test, the contacting probe works as an additional, virtual Boundary Scan cell, enabling the detection of a non-soldered pin. The combination of Flying Prober and Boundary Scan provide an ideal
fit, especially for assemblies containing BGAs and a significant percentage of discrete components. The interaction of both systems leads to a considerably higher fault coverage, compared to sep- arated test procedures. A SPEA spokesperson: the per-
fectly integrated combination of fly- ing probe capabilities with the elec- tronic Boundary Scan measurement module meets the need for high-per- formance digital testing, providing the extraordinary results made pos- sible by using these complementary techniques together. The integration is not just the
combining of flying probes and boundary scan. The system has been optimized in a way that provides the benefits of a single software inter- face. The automatic test program generation is able to combine in-cir- cuit and boundary scan test, avoiding
Flying prober used in integrated test system.
executed on components that are not JTAG-type, by forcing the appropri- ate signals through the flying probes. To save time, after the first test
run test developers can determine a maximum number of contact points in which only faulty nets are repeated. These test step reductions produce additional time savings with the Flying Prober. Nets, which are cov- ered by Boundary Scan, can be exclud- ed from the SPEA test run. The inte- grated fault report displays both
any redundancy in the test coverage thereby optimizing test time. All of the tests that are already covered by the boundary scan are no longer per- formed during in-circuit testing. In addition, boundary scan test can be
errors detected by the Flying Prober as well as the Boundary Scan subsys- tem in the output window of the 4060 system. The integration is supported by both SPEA’s Leonardo Software and Goepel electronic’s SYSTEM CAS- CON™. Goepel provides complete integration packages on various levels that differ in hardware performance and software options. Each integration package con-
tains an SFX/ ASL1149.-(x) controller for USB, LAN and cabled PCI Express, as well as an SFX-TAP4/FXT TAP Trans ceiver with differential sig- nal transmission TIC02/ SR modules (TIC: Tap Inter face Card) to be installed into the shuttle. The SCANFLEX®
principle
enables optimized signal quality for test frequencies of up to 80MHz under ideal conditions. That means that cutting-edge test technologies such as VarioTAP®
or ChipVORX®
can be efficiently utilized in the ATE system in the future. Contact: SPEA America, 2609
SSW Loop 323, Tyler, TX 75701 % 903-595-4433 fax: 903-595-5003 E-mail:
sales@speaamerica.com Web:
www.spea.com
See at Semicon West Booth 6785.
Kyzen Aqueous Cleaner Is Proven Technology
Nashville, TN — Kyzen is showcas- ing the proven technology of its AQUANOX®
A4520 aqueous cleaning
system for semiconductor materials. The highly tested aqueous cleaner for flip chips and advanced packag- ing has proven to be effective on all lead-free, no-clean and eutectic materials when run at low tempera- tures and low concentrations. According to the company, the
cleaner is easy to use, it is effective without the use of sump-side addi- tives and provides brilliant joints. It is used widely in military applica- tions or anywhere a robust cleaner is needed for the harder-to-clean fluxes. In addition, A4520 has a long
bath life, is RoHS-compliant, contains no CFCs or HAPs, and is a biodegrad- able aqueous solution. The cleaning chemistry can clean numerous soils including lead-free flux, tacky flux, reflowed paste, no-clean flux, RMA flux, OA paste, oils, fingerprints, light oxides and polymerized soils. This best-in-class cleaning chemistry pro- vides the lowest cost of ownership
See us at Semicon West Booth 1827 South
Proven effective aqueous cleaner. Contact: Kyzen Corporation,
430 Harding Industrial Drive, Nashville, TN 37211 % 615-831-0888 fax: 615-831-0889 E-mail:
info@kyzen.com Web:
www.kyzen.com
See at Semicon West Booth 6180.
technology in the industry, while exceeding industry standards for peo- ple and environmental safety. It is available in one, five, and 55 gallon (3.78, 19, and 208 liter) containers.
July, 2011
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