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www.us-tech.com
July, 2011
Leica: High-Throughput Inspection Systems
Wetzlar, Germany — Leica Micro - systems has launched a new line of products that meet the requirements for inspection, process control and defect analysis of wafers in the semi-
grated into the stand of both instru- ments. Without a lamp housing to get in the way, there is an optimal airflow around the microscope. Another advantage of the power
High-throughput inspection system. ¸ RoHS 1/22/09 3:48 PM Page 1 See us at Semicon West Booth 5477 North
REFLOW SOLDERING SYSTEMS
CONDUCTION + CONVECTION HEAT
Reflow Soldering & Curing Applications include:
• BGA Reballing • BGA Packaging Falcon 5/C • Die/Heat Sink Bonding
• High Density Packaging/Substrates • Laminated Power Components
• Laser Diode Reflow • Lead Frames • Microwave Hybrids, Fluxless Au/Sn Reflow • Extremely Low O2 ppm Capability w/low N2 Consumption SIKAMA INTERNATIONAL, Inc. 118 E. Gutierrez Street • Santa Barbara, CA 93101-2314 U.S.A.
Tel: 1-805-962-1000 • Fax: 1-805-962-6100 •
sales@sikama.com •
www.sikama.com See us at Semicon West Booth 6060 North
conductor industry — the Leica DM8000 M and the Leica DM12000 M for 8- or 12-in. (200 or 300mm) wafers, respectively. The integrated macro mode of
the Leica DM8000 M and DM12000 M optical inspection microscopes pro- vides up to four times the field of view of conventional scanning objectives. Thus the entire scan area can be accu- rately checked for possible defects. The LED illumination is inte-
LEDs is their extremely long lifetime and low power consumption, making them both economical and more envi- ronmentally-friendly. In addition to the visible light, the optional i-line UV illumination is also LED-based. Contact: Leica Microsystems,
1700 Leider LN, Buffalo Grove, IL 60085 % 847-405-7062 Web:
www.leica-microsystems.com
See at Semicon West Booth 6065.
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