industry interview
Improved LED production with
integrated vacuum and abatement
Companies seek to constantly improve their production methods. HBLED manufacturers are faced with many challenges including vacuum and abatement. Mike Czerniak, Product Marketing Manager, Exhaust Gas Management at Edwards discusses the benefits of combustion based abatement technology.
T
he technology used to manufacture high brightness
LEDs (HBLEDs) made from gallium nitride (GaN) has developed rapidly over the last dozen years, and market growth has continued, despite the current economic slowdown. This is a combination of developments in LED technology, the size and contrast benefits LEDs offer in flat panel applications and adesire by both governments and individual consumers around the world to reduce energy consumption due to concerns about global warming.
Current market opportunities driving the expansion in LED production already include laptop computers, as well as liquid crystal displays (LCD) backlighting used in LED TVs and automotive applications. The LED consumer lighting market is also showing growth as LED efficiency has increased to over 100 lumens per watt. For LED technology to become truly competitive in mass- market applications, however, it must still achieve even greater reductions in the initial cost per lumen.
LED manufacturers hope to achieve this cost reduction through economy of scale that comes with high volume production. Increasing production is dependent upon demand. LED manufacturing strategies are focused on addressing the technical aspects of high-volume production, while also minimizing both the capital expenditures and operating costs of production equipment.
As manufacturing processes scale to higher volumes, the relative contribution of variable costs to cost- of-ownership (CoO) often grows as fixed costs are distributed over the increased volume of production. In addition, ramping LED volume production also increases the demands on both vacuum and abatement systems, which must handle higher volumes of production gases or manufacturing by-products, respectively.
The GaN compound semiconductor manufacturing processes used to produce LEDs require large flows of hydrogen and ammonia. Because of the small size of the hydrogen molecule, this gas is difficult to pump, especially in high volumes. At the same time, depending on the abatement technology in use, ammonia can produce solid by- products during the waste removal process that tend to clog the bath, recirculation pump and drain pipes in
36
www.compoundsemiconductor.net April/May 2010
conventional wet scrubbers, requiring them to be cleaned every month or two, during which time the production tools are idle, reducing productivity and increasing tool CoO.
This article discusses the pumping and abatement requirements needed to accommodate the use of hydrogen and ammonia in HBLED production, and highlights an abatement technology that can significantly reduce manufacturing cost of ownership. It also presents a new approach to implementing vacuum and abatement systems within a process tool that can help to further reduce system CoO.
Vacuum Pumping
Pumping hydrogen, regardless of the process involved, presents certain challenges because of the gas’s small molecular size and low viscosity, which is approximately half that of nitrogen. While these characteristics are not an issue when
Figure 1: HBLEDs are replacing
incandescent bulbs in
automobiles.
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120 |
Page 121 |
Page 122 |
Page 123 |
Page 124 |
Page 125 |
Page 126 |
Page 127 |
Page 128 |
Page 129 |
Page 130 |
Page 131 |
Page 132 |
Page 133 |
Page 134 |
Page 135 |
Page 136 |
Page 137 |
Page 138 |
Page 139 |
Page 140 |
Page 141 |
Page 142 |
Page 143 |
Page 144 |
Page 145 |
Page 146 |
Page 147 |
Page 148 |
Page 149 |
Page 150 |
Page 151 |
Page 152 |
Page 153 |
Page 154 |
Page 155 |
Page 156 |
Page 157 |
Page 158 |
Page 159 |
Page 160 |
Page 161 |
Page 162 |
Page 163 |
Page 164 |
Page 165 |
Page 166 |
Page 167 |
Page 168 |
Page 169 |
Page 170 |
Page 171 |
Page 172 |
Page 173 |
Page 174 |
Page 175 |
Page 176 |
Page 177 |
Page 178 |
Page 179 |
Page 180 |
Page 181 |
Page 182 |
Page 183 |
Page 184 |
Page 185 |
Page 186 |
Page 187 |
Page 188 |
Page 189 |
Page 190 |
Page 191 |
Page 192 |
Page 193 |
Page 194 |
Page 195 |
Page 196 |
Page 197 |
Page 198 |
Page 199 |
Page 200 |
Page 201 |
Page 202 |
Page 203 |
Page 204 |
Page 205 |
Page 206 |
Page 207 |
Page 208 |
Page 209 |
Page 210 |
Page 211 |
Page 212 |
Page 213 |
Page 214 |
Page 215 |
Page 216 |
Page 217 |
Page 218 |
Page 219 |
Page 220 |
Page 221 |
Page 222 |
Page 223 |
Page 224 |
Page 225 |
Page 226 |
Page 227 |
Page 228 |
Page 229 |
Page 230 |
Page 231 |
Page 232 |
Page 233 |
Page 234 |
Page 235 |
Page 236 |
Page 237 |
Page 238 |
Page 239 |
Page 240 |
Page 241 |
Page 242 |
Page 243 |
Page 244 |
Page 245 |
Page 246 |
Page 247 |
Page 248 |
Page 249 |
Page 250 |
Page 251 |
Page 252 |
Page 253 |
Page 254 |
Page 255 |
Page 256 |
Page 257 |
Page 258 |
Page 259 |
Page 260 |
Page 261 |
Page 262 |
Page 263 |
Page 264 |
Page 265 |
Page 266 |
Page 267 |
Page 268 |
Page 269 |
Page 270 |
Page 271 |
Page 272