total wafer level yield budget. Implementation of inline inspection and SPC monitoring of the MOCVD process could cut the yield loss from epi defects in half.
These yield and productivity (MOCVD uptime) enhancements are achieved through killer defect
reduction, early detection and prevention of minor and major excursion trends. KLA-Tencor’s Candela surface inspection system allows comprehensive inspection and control of epi process and helps LED manufacturers realize this multi-million dollar yield opportunity.