news digest ♦ compound semiconductor
to minimize power consumption, cost and reliability concerns.
The need for absolute reliability using commercially available chips requires significant cooling of the chip to be provided. The resulting power demands and heat dissipation have a major impact on the design, operation and cost of optical amplification systems. Utilizing in- house “state of the art” laser chips and class- leading alignment technology, 3S PHOTONICS offers the most efficient range of pump laser modules on the market today.
Whether it is EDFA or Raman amplification, the class-leading reliability of the 3S PHOTONICS pump laser chips enables either very high optical output or significantly reduced cooling, whichever is the design priority. The ultimate result is the lowest initial and operating cost/Bit of transmitted data.
The complete product range includes conventionally cooled, 45°C cooled or un-cooled pump laser modules. The 1999 HPM and 1999 CHP Series are conventionally cooled devices with operating power up to 430 and 720mW respectively. These versions use up to 20% less power compared to competing solutions and are a straightforward drop-in replacement. The 1999 HEP is a 45°C cooled product with operating power up to 450mW which requires up to 50% less power to operate. For the greatest savings of all, the 1999 HPU provides operating power up 400mW and an 80% reduction in power consumption.
These savings have been achieved through the incorporation of the submarine qualified 1999 LCv2 laser chip which is produced at the 3S PHOTONICS facility in Nozay, France. With a hermetically sealed, 14-pin Butterfly or Mini- DIL package, and Fiber Bragg Grating (FBG) stabilization integrated into the fibre pigtail, all products provide stable performance over a wide dynamic range. All modules are qualified to Telcordia GR-468-CORE and provide the lowest failure in time (FIT) rates in the industry.
202
www.compoundsemiconductor.net April/May 2010
The whole range of 3S PHOTONICS’ pump lasers have been designed to be easily integrated into both old and new amplifier platforms with minimum re-engineering required. “If you look at the growing demand for sustainable energy usage and continuous cost reduction pressures in all industry sectors, power consumption reductions up to 80% will help contribute to the Green Revolution that is required in the telecom sector” said Yannick Bailly, Vice-President of Marketing and Product Lines Management at 3S PHOTONICS. “In addition, the significant Capex and Opex reductions demonstrate a true “win-win” for both the environment and business. About 3S PHOTONICS
3S PHOTONICS – formerly Alcatel Optronics – is the leading world manufacturer of laser chips, optical discrete modules and components for undersea telecommunication networks. It designs, develops, manufactures and commercializes active components powered by in-house III-V optoelectronic chips based on both Gallium Arsenide (GaAs) and Indium Phosphide (InP) technologies and passive components using Fiber Bragg Gratings (FBG).
The 3S PHOTONICS renowned optoelectronic chip manufacturing plant of Nozay is a technological feat that is unique in the world as it brings together GaAs and InP technologies under the same roof.
Its product portfolio includes five product lines:
* Transmission Laser and Detector Modules * Pump Laser Modules for terrestrial and submarine applications
* Chromatic Dispersion Compensation Modules * Filters, gain equalizers and pump stabilizers based on Fiber Bragg Gratings for terrestrial and submarine applications * Chips (lasers and detectors) and Front End Services
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120 |
Page 121 |
Page 122 |
Page 123 |
Page 124 |
Page 125 |
Page 126 |
Page 127 |
Page 128 |
Page 129 |
Page 130 |
Page 131 |
Page 132 |
Page 133 |
Page 134 |
Page 135 |
Page 136 |
Page 137 |
Page 138 |
Page 139 |
Page 140 |
Page 141 |
Page 142 |
Page 143 |
Page 144 |
Page 145 |
Page 146 |
Page 147 |
Page 148 |
Page 149 |
Page 150 |
Page 151 |
Page 152 |
Page 153 |
Page 154 |
Page 155 |
Page 156 |
Page 157 |
Page 158 |
Page 159 |
Page 160 |
Page 161 |
Page 162 |
Page 163 |
Page 164 |
Page 165 |
Page 166 |
Page 167 |
Page 168 |
Page 169 |
Page 170 |
Page 171 |
Page 172 |
Page 173 |
Page 174 |
Page 175 |
Page 176 |
Page 177 |
Page 178 |
Page 179 |
Page 180 |
Page 181 |
Page 182 |
Page 183 |
Page 184 |
Page 185 |
Page 186 |
Page 187 |
Page 188 |
Page 189 |
Page 190 |
Page 191 |
Page 192 |
Page 193 |
Page 194 |
Page 195 |
Page 196 |
Page 197 |
Page 198 |
Page 199 |
Page 200 |
Page 201 |
Page 202 |
Page 203 |
Page 204 |
Page 205 |
Page 206 |
Page 207 |
Page 208 |
Page 209 |
Page 210 |
Page 211 |
Page 212 |
Page 213 |
Page 214 |
Page 215 |
Page 216 |
Page 217 |
Page 218 |
Page 219 |
Page 220 |
Page 221 |
Page 222 |
Page 223 |
Page 224 |
Page 225 |
Page 226 |
Page 227 |
Page 228 |
Page 229 |
Page 230 |
Page 231 |
Page 232 |
Page 233 |
Page 234 |
Page 235 |
Page 236 |
Page 237 |
Page 238 |
Page 239 |
Page 240 |
Page 241 |
Page 242 |
Page 243 |
Page 244 |
Page 245 |
Page 246 |
Page 247 |
Page 248 |
Page 249 |
Page 250 |
Page 251 |
Page 252 |
Page 253 |
Page 254 |
Page 255 |
Page 256 |
Page 257 |
Page 258 |
Page 259 |
Page 260 |
Page 261 |
Page 262 |
Page 263 |
Page 264 |
Page 265 |
Page 266 |
Page 267 |
Page 268 |
Page 269 |
Page 270 |
Page 271 |
Page 272