compound semiconductor ♦ news digest
forge collaborative ties in support of Nemotek’s growth.” The EVG systems augment Nemotek’s class 10 cleanroom, which already houses several EVG tools, including an EVG6200 bond aligner, a fully automated IQ Aligner UV-NIL system, an EVG520IS wafer bonder, and an EVG40NT metrology system. The two new tools will be installed in phases with the two-bond chamber EVG520IS for CMOS image sensor manufacturing, to be completed this month. The second IQ Aligner UV-NIL system for micro-lens molding, bond alignment and UV bonding of micro-optics stacks will be installed later this year. The wafer-level camera equipment market represents another high-growth segment in which EVG has successfully established its technology process and expertise. Its dominant position in this market contributed to EVG’s financial success in 2009, when the company continued to see an increase in both order intake and revenue despite the global economic recession.
About Nemotek Technologie Nemotek
Technologie manufactures customized Wafer- Level Cameras for portable applications. The company provides customers with design and manufacturing services for Wafer-Level Packaging, Wafer-Level Optics and Wafer- Level Cameras. Established in May 2008, Nemotek Technologie is funded by Caisse de Depot et de Gestion (CDG). The company features a world-class manufacturing and clean room facility located in the Rabat Technology Park, a hub for technology development based in Morocco. For more information, visit: http://
www.nemotektechnologies.com/
About EV Group EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low- cost-of-ownership systems that are easily integrated into customers’ fab lines. Key products include wafer bonding, lithography/ nanoimprint lithography (NIL) and metrology
equipment, as well as photoresist coaters, cleaners and inspection systems. In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co- founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost- effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon- on-insulator (SOI), compound semiconductor and silicon-based power-device solutions. Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung- Li, Taiwan. The company’s unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. More information is available at
www.EVGroup.com.
Purdue University to receive AIXTRON Black Magic tool for carbon nanomaterials
2010-03-30
AIXTRON AG today announced an order for one Black Magic deposition system from Purdue University’s Birck Nanotechnology Center in West Lafayette, IN, USA.
The order is for a 2 inch wafer configuration system for the deposition of carbon nanomaterials and high-k oxides by atomic layer deposition (ALD). The order was received in the fourth quarter of 2009 and the system will be delivered in the second quarter of 2010.
While acknowledging the Army Research Office for the support of this project through the US Department of Defense’s DURIP program, Associate Professor Peide Ye of
April/May 2010
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