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www.us-tech.com
Nitrogen Generation’s Critical Role in Soldering
By Heather Divoky, Marketing Coordinator, and Greg Pope, Marketing Manager, South-Tek Systems, LLC
ing, structures, and environments. For this reason, nitrogen gas has been used successfully to create and maintain clean, dry, inert atmospheres. Nitrogen is used in PCB manufacturing in selec- tive soldering, reflow soldering and ovens. While bulk nitrogen is often bought for this purpose, a nitrogen generator offers a safer, more cost-effec- tive way of obtaining nitrogen gas. There are many ways to obtain the nitrogen
A
necessary for reflow soldering, ovens, and selective soldering. Some of these methods include buying bulk liquid nitrogen, using liquid dewars, and using high-pressure cylinders. Another method is generating nitrogen from air. This process is con- venient, safe, and cost-effective, especially when compared with the previous methods. A nitrogen generator produces high-purity N2
gas at the point of process safely, reliably and effi- ciently. From portable and compact systems to large, high-output systems, nitrogen generators allow businesses, property owners and govern-
ment operations to produce their own N2 gas on demand. Membrane and PSA Technology There are two ways of generating nitrogen:
membrane and pressure swing adsorption (PSA)
technology. Nitrogen generators separate N2 mole- cules directly from the air we breathe. Air contains 79 percent nitrogen and these generators use sim- ple, green technology to filter out the other gases, concentrating the nitrogen gas into a storage tank for process usage. Nitrogen generators with membrane technol-
South-Tek Systems N2-GEN® nitrogen gas generators.
while allowing nitrogen to flow through its center
and emerge as high purity N2 gas. PSA technology uses a carbon molecular sieve
(CMS) to adsorb oxygen and water vapor mole- cules under high pressure, while allowing nitrogen to pass through. A sieve bed pressure vessel is filled with the CMS, which is then pressurized
with air. O2, CO2, CO, and other molecules are cap- tured and held inside the CMS while N2 molecules are drawn off into a receiving tank. O2, CO2, CO, and other molecules are then flushed from the
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Fault
CableEye Wiring Report Name: HD44M-HD44F-S39X
Socket L HD44 Male
SH 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 21 22 23 24 25 26 27 28 29 30 16 17 31 32 33 34 35 36 37 38 39 40 41 42 43 44 M A T C H D A T A 1-6-18 10:57 AM
Print your company information here. Set up in Preferences / Print Options. Z-AXIS CONTROLLER CABLE
Socket R HD44 Female
SH 31 32 33 34 35 36 37 38 39 40 41 42 43 44 21 22 23 24 25 26 27 28 29 30 5 6 7 8 9 10 11 12 13 14 15 16 2 3
controlled atmosphere is absolutely neces- sary for electronic manufacturing, as it requires very particular temperatures, tim-
ogy use compressed air forced through a polymeric hollow fiber to selectively permeate oxygen, water vapor and other impurities out of its side walls,
CMS by depressurizing the sieve bed. Finally, the CMS is flushed and cleansed, ready for new air.
Nitrogen Gas in Electronics Nitrogen gas is used for electronics manufac-
turing in situations where it is critical to reduce oxygen and maintain a clean, dry atmosphere. There are several examples of this, although nitro- gen gas is used most often for PCB manufacturing processes that include reflow soldering and selec- tive soldering to attach surface mount components to the board. Nitrogen is vital for reflow soldering and
reflow oven applications. With the increased use of SMT replacing through-hole technology, reflow soldering of surface mount components onto print- ed circuit boards is widespread. Reflow ovens pro- vide a time- and temperature-controlled environ- ment for the effective soldering of surface mount components. For reflow soldering, components are placed
on top of a PCB on solder pads with solder paste applied. These boards are then conveyed into the reflow oven, which melts the solder particles in the solder paste, bonding the components to the pads on the circuit boards. There are different styles of reflow soldering, but convection soldering generally uses nitrogen
gas applied to base metals. The N2 gas minimizes oxidation of the surfaces to be soldered. The chem- ical reactions necessary for soldering require high temperatures, but metal oxidizes at a faster rate with heat applied, weakening the solder. Selective soldering, another application that
uses nitrogen, is often employed when the heat of the reflow oven may be too great for some SMT
Continued on page 56
August, 2018
N E T L I S T
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L-10 L-11 L-12 L-13
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L-5 R-5 R-6 R-7 R-8 R-9
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N O T E S
Z-AXIS CONTROLLER CABLE Connector Type: High-density Dsub, 44 pins. Connector must have machined pins and metal shell. Use AMP part 778224-6.
NOTE: Pins 10-15 and 40-44 of this high-density cable carry rarely-used signals and may not be wired in the cable you are testing. This is acceptable.
L A B E L
Z-AXIS CONTROLLER Part Number 355-425A
CableEye® by CAMI Research Inc.
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