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www.us-tech.com
August, 2018
FKN Systek Intros Quick Adjust PCB Transport Racks
Your trusted partner in automation and inspection
We offer advanced SPI, AOI and AXI solutions
Millis, MA — FKN Systek is now of- fering stackable PCB transport and storage racks made of conductive ma- terial, designed for safe and conven- ient PCB handling during assembly. The racks hold up to 50 PCBs from 2 to 9.8 in. (5.1 to 24.9 cm). Racks are made of conductive plastic that can withstand temperatures of up to 176°F (80°C). The width of the rack can be ad-
justed quickly for different PCB sizes by unlocking the stop latches on the top panel, pushing the side plate to the correct position and resetting the posi- tion holders. A special chain and sprocket mechanism ensures that the sides of the panel are held during ad- justment. Adjusting the rack for a new PCB size takes less than 20 seconds. FKN Systek designs and manu-
factures a wide variety of tools for PCB singulation and handling, as well as wire crimp and assembly tools and step motors. The company’s product range includes low-cost tools, such as the N100 PCB Nibbler, used
to singulate tab-routed panels, along with high-volume production sys- tems that include the K6000 inline multiple circular blade depanelizer
PCB transport rack.
for singulating pre-scored boards. Contact: FKN Systek, 115
Pleasant Street, Millis, MA 02054 % 508-376-2500 fax: 508-376-2505
E-mail:
fkn@fknsystek.com Web:
www.fknsystek.com
CUI and SnapEDA Offer Free PCB Footprint Files
Tualatin, OR — CUI has teamed up with SnapEDA, a parts library for circuit board design, to offer a catalog of free, ready-to-download PCB foot- prints and symbols for CUI’s range of board-mount electromechanical com- ponents.
Circuit board design has histor-
ically been a time-consuming and challenging process, due to the vari- ety of product configurations and standards. With this partnership, users will be able to prevent footprint errors and design efficiently, with a library of verified PCB footprints and symbols available in all major CAD formats. Formats include Altium, Eagle, KiCad, OrCAD/Allegro, PADS/DxDesigner, and PCB123. The files are free to download
from CUI’s CAD model library and product pages, or from SnapEDA’s website, where they can then be placed directly into a design. Accord- ing to CUI, the partnership is a con-
Omron provides innovative automation technologies that are integrated, intelligent, and interactive.
tinuation of the company’s mission to equip its customers with necessary design tools and resources at every stage of the product development cycle. The addition of these PCB foot- print files bolsters CUI’s extensive catalog of ready-made 3D models, further streamlining the design process for engineers.
SnapEDA provides ready-to-use
building blocks for circuit board de- sign through its website and PCB de- sign tool plugins. Using these tools, designers can shave days off of prod- uct development, so that engineers can focus on product optimization and innovation. Over half a million users use SnapEDA each year, eval- uating nearly two million electronic
components. Contact: CUI, Inc., 20050 S.W.
112th Avenue, Tualatin, OR 97062 % 503-612-2300 fax: 503-612-2383
E-mail:
jschnabel@cui.com Web:
www.cui.com
TANAKA Expands Range of Gold Bonding Wire
Milledgeville, GA — TANAKA Pre- cious Metals has recently expanded its range of Type AuR gold ribbon bonding wire, stocked and distributed in North America by TopLine Corporation. AuR gold bonding ribbon is fabricated to 4N specifications with 99.99 percent puri- ty using a dry process. Thicknesses range from 0.5 to 2
inspection.omron.us Sensing | Control | Safety | Vision | Motion | Robotics See at NEPCON South China, Booth 1C55 and IMTS, Booth 134845
mil (12.7 to 50 µm). Widths range from 1 to 9.8 mil (25 to 250 µm). AuR gold bonding ribbon is typically packaged on 2 in. (5 cm) high-purity ribbon spools with lengths up to 328 ft (100m). TANAKA’s proprietary process
uses no lubrication oils during fabrica- tion, providing the benefits of excellent corrosion resistance and no material build-up during bonding. Type AuR gold bonding ribbon is produced using a rolled process with stress relief. The edges are smooth without sharp cor- ners, providing a surface that enables
a stable bonding process. Type AuR is an excellent solu-
tion for RF devices, high-reliability applications and high-power applica- tions, such as laser and microwave
Type AuR gold ribbon bonding wire.
devices. AuR is fabricated in Japan
on world-class production lines. Contact: TopLine Corp., 95
Highway 22 W., Milledgeville, GA 31061 % 800-776-9888 fax: 478-451- 3000 E-mail:
sales@topline.tv Web:
www.topline.tv
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