June, 2020
www.us-
tech.com
Smart Sonic Offers Ultrasonic SMD Adhesive Cleaning
Cleveland, OH — Smart Sonic’s ul- trasonic cleaning process can be used for SMD adhesive cleaning, though the process is not as simple as clean- ing solder paste. Cleaning solder paste is easier, because it contains particulate matter (solder balls). The solid balls “reflect” the cavitational energy of the ultrasonics, causing greater cleaning action. The paste then falls freely from
the stencil or misprinted board from the weight of the solder balls. Adhesives, on the other hand,
do not contain particulate matter. They are soft and tacky. The soft tex- ture of the adhesive will absorb the ultrasonic energy, creating less cavi- tational cleaning action. Also, be- cause there is no particulate matter, the adhesive does not fall away from the stencil or board. Solder paste must be cleaned
from stencils at ambient tempera- ture, since the glue that bonds the screen mesh to the frame and metal- etched foil is heat sensitive. These glues are usually heat-cured at ap- proximately 160°F (70°C). If the stencil is washed in hot water or dried with hot air, the glue could ap- proach the curing temperature and debond. Another heat-related problem is the different metals used in a stencil
Cyanide-Free Silver Plating Process from Technic
Cranston, RI —Technic has released a new cyanide-free silver plating process chemistry, Technisilver Cyless® II W, designed for general metal finishing, decorative and electronic component and connector applications. Cyless II W addresses the global
demand for an environmentally safe, high-performance silver process. The process is a significant addition to Technic’s existing line of cyanide-free products. The process produces a bright, non-yellow appearance with even distribution.
— aluminum frame, stainless steel or polyester screen and stainless steel, brass or nickel-etched foils. These metals will expand or contract at a different rate than the glue, causing stress on the glue joints. This expan- sion and contraction also causes dis- tortion of the etched image and ten- sion problems with the screen, lead- ing to misprint problems. Smart Sonic cleans SMD adhe-
sives by heating its 440-R solution to between 110 and 120°F (43 and 49°C). It would not be practical to at- tempt to clean solder paste and adhe- sives from stencils using a single ma-
Smart Sonic’s 440-R can be used to clean SMD adhesives.
chine. It would take hours to heat the wash solution to clean adhesives and then more hours to cool it down to safely clean solder paste. Plus, the glue will contaminate the wash solu- tion and could leave residue on the stencil. Smart Sonic’s best solution for cleaning SMD adhesives is its semi-automatic model with a heater
control package option. Contact: Smart Sonic Corp., 837
E. 79 Street, Cleveland, OH 44103 % 818-610-7900
fax: 818-610-7909 E-mail:
smt@smartsonic.com Web:
www.smartsonic.com
Page 27
The right solutions happen when
you care enough to ask the right questions. KYZEN®
E5631 Next Generation Stencil Cleaner
Inset photos:
Technisilver Cyless II W silver plated components.
Easily controlled adjustments
provide a bright or semi-bright fin- ish, as desired. This high-performing alternative to existing cyanide processes demonstrates Technic’s on- going commitment to offering envi- ronmentally responsible advanced
finishing solutions. Contact: Technic, 47 Molter
Street, Cranston, RI 02910 % 401-781-6100
E-mail:
info@technic.com Web:
www.technic.com
Request expert cleaning advice and technical support at
KYZENcares.com!
At KYZEN, we have the SCIENCE and expertise to solve any cleaning problem, and the CARE to find the perfect solution for your individual cleaning process. When science and care converge, your cleaning process succeeds on every level.
KY Z E N . C OM WORLDWIDE ENVIRONMENTALLY RESPONSIBLE CLEANING TECHNOLOGIES
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