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June, 2020 ElEctronic Mfg Products
Rehm Adds Integrated Cooling Solution to VisionXP+
Roswell, GA — For optimal reflow soldering, a stable and reliable cool- ing process is critical. Rehm’s Vi- sionXP+ convection soldering system can be outfitted with an innovative
–292°F (–180°C) cold liquid nitrogen releases its energy in the cooling line, evaporates, and can then be used in its gaseous state for inerting the process atmosphere. The cooling water,
which previously required high energy use, is com- pletely eliminated. The entire nitrogen
Cooling section of a convection soldering system.
cooling design that uses liquid nitro- gen. The company also offers a stan- dard cooling option with up to four cooling modules, an extended cooling line, underside cooling, and an ener- gy-saving model. Along with Air Liquide, Rehm
has developed CoolFlow, which de- ploys nitrogen efficiently. The
path — from the main valve, through the volume flow control and safety sen- sors, to the passively con- trolled gaseous nitrogen supply — now fits entirely inside the plant housing. Only a hose for gaseous ni- trogen and a vacuum-insu- lated line for liquid nitro- gen feed into the system from the outside. Cooling is controlled
using the software, by
specifying the frequencies and vol- ume flow rate as required. If the cool- ing line temperature is too high, the operator increases the volume flow of liquid nitrogen through the coolers. Everything else is controlled by the system itself. An excess of nitrogen from the coolers is fed into the exhaust air to
compensate for a shortfall from the gas network. CoolFlow also has fea- tures to promote safe working condi- tions, including an automatic emer- gency shutoff of the liquid nitrogen supply.
Hayward, CA — Seika is now offering the PCU-285 spiral viscometer and DS-10S dip tester from Malcom. The DS-10S dip tester for selective solder- ing equipment is designed to improve process management efficiency by measuring solder temperature, solder- ing time, board temperature increases and peak conditions, soldering head movement speeds, and solder head di- ameter all at once. The PCU-285 spiral viscometer
is designed to measure solder paste viscosity. It includes a compact and enhanced heating unit, making it easier to put in or take out the sam- ple and to simplify cleaning. The viscometer offers new func-
tions that make it possible to create, execute and store measurement pro- grams with or without a PC. The sys-
Contact: Rehm Thermal Sys- tems, LLC, 3080 Northfield Place,
Suite 109, Roswell, GA 30076 % 770-442-8913 fax: 770-442-8914 E-mail:
c.kramer@
rehm-group.com Web:
www.rehm-group.com
Seika Offers New Solder Paste Testing Solutions
tem uses a touch panel display for improved functionality and visibility. In addition, temperature control and viscosity measurement have been
DS-10S dip tester from Malcom. improved greatly, in both stability
and speed. Contact: Seika Machinery, Inc.,
23785 Cabot Boulevard, Suite 306, Hayward, CA 94545 % 510-293-0580 E-mail:
info@seikausa.com Web:
www.seikausa.com
EXATRON TEST SOCKETS
Test and program sockets custom made to fit any footprint and any application, from manual test to high-volume automated handlers.
BGA, IC, MSOP, QFN, WLCSP and more.
Copperhead® Thermal Test Sockets specifically designed for optimal thermal test performance.
See our new website dedicated to test sockets:
EXATRONTESTSOCKETS.COM
COPPERHEAD® THERMAL TEST SOCKET
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