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tech.com
July, 2019
Seica: Flying Probe Testers to Meet Diverse Market Needs
By David Sigillo, Vice President, Seica, Inc.
this year. A leading provider of flying probe technology, Seica’s newest line of testers brings with it key advances and features required in the semicon- ductor market. The traditional Seica V8 Next>
S
series flying prober comes packed with many features and test tech- niques required for the traditional original equipment manufacturer (OEM) and contract manufacturer (CM). Features that include in-cir- cuit testing, AOI inspection, bound- ary scan, onboard programming (OBP), LED testing and power up functional testing are must-haves for the traditional market. Combining these features with
a true doubled-sided and vertical board testing flying probe architec- ture, 100 percent of the standard OEM and CM market can capitalize on the standard features. However, a semiconductor customer may be hard-pressed and challenged to fully test one of their products, such as a probe card, interface card, or sub- strate, without advanced features seen in one of Seica’s latest innova- tions — the Pilot V8 HR Next> (high
eica will be exhibiting its latest flying prober, Pilot V8 Next>, in booth 1865 at SEMICON West
resolution), Pilot V8 HF Next> (high frequency), or Pilot V8 XL Next> (extra large).
Challenging Board Sizes Starting with the basics and the
mechanical designs associated with probe cards and their construction, the very first constraint a user may
notice is the size of the cards them- selves. Traditional flying probe test area sizes can be a limiting factor, so much so, that the probe cards do not even fit in the test area. To accommo- date this market requirement, Seica developed a flying prober, the Pilot V8 XL Next>, to accommodate board sizes up to 31.5 x 25.6 in. (80 x 65 cm)
However, the board area may
not be the only limiting factor, as board thickness and weight are also a concern. Board construction easily exceeds 50 layers in most cases, and the boards will not meet traditional thicknesses of 0.093 to 0.125 in. (2.4 x 3.2 mm). The Seica “XL” structure can
accommodate up to a standard of 0.276” (7 mm) with options for even larger thickness, as well as weight. One benefit of Seica’s architecture is the vertical nature of mounting the unit under test (UUT). If this were a horizontal flying probe system, as the board size/span increases, the weight increases in a corresponding fashion resulting in bow and deflection of the UUT.
The vertical architecture of the
Pilot V8 HR Next> series flying probe system. High-frequency testing allows for environmental product validation.
CONASHIELD “Flood Coat” Technology
Comparable Performance to Standard Potting Systems with a 30 to 60% reduction in weight
Better Electronic Insulation and Vibration Dampening Properties than Traditional Conformal Coating Systems
A True Balance of Properties Horizontal
Build 4-8mm
Surface Mount Components
Vertical Build 2-4mm
Circuit Board
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and processes, you can leak test virtually any type of package with one high-speed system. The NorCom 2020™
series inspects hermetically sealed components to
MIL-STD 883 requirements either in seam seal trays, or when already mounted to circuits boards and assemblies. It automatically rejects failed devices, and reports the leak rate for each part, eliminating “divide and conquer”leak testing.
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www.norcomsystemsinc.com Electronic & Engineering Materials
www.elantas.com/pdg 314.621.5700
610-592-0167 1055West Germantown Pike Norristown, PA 19403 USA
See at SEMICON West, Booth 6058 TM 4/29/10 5:45 PM Page 1
Pilot V8 Next> series of testers signif- icantly reduces the bow and deflec- tion, allowing for faster speed and accuracy of the probing needles on the very small test points. The vertical architecture does not require the use of bottom-side flying probe supports, or expensive jigs and shuttles that could inhibit test area for bottom-side testing. With its enhanced vertical clamping design, probe cards that exceed 15 lb (6.8 kg) have been tested
Continued on next page
Test for gross and fine leaks in as little as 6 minutes.*
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