July, 2019 Continued from page 63 In a thermal cycling test, it was shown that


there are significant differences in the reliability of SN100C versus that of the Sn-3.8Ag-0.7Cu alloy. After 2,000 cycles, cracks started to appear. At 4,000 cycles the alloy failed completely. In the sol- der joints made with SN100C, there was no signif- icant cracking until 4,000 cycles.


Nihon Superior’s Heritage Nihon Superior has been a leader in soldering


and brazing since it was founded in 1966 by Toshiro Nishimura and continues its tradition of developing lead-free joining materials with improvements in reliability, thermally stable join- ing and lead-free die attach. Toshiro’s son, Tetsuro, now runs the company and Toshiro’s grandson, Takatoshi, is also involved in the com- pany, making Nihon Superior a third-generation family-owned business. The company continues to


develop highly reliable products and is committed to earning its cus- tomers’ highest level of trust by tak- ing full responsibility for every prod- uct delivered. The company remains ready to meet rising demands for diversification, increasingly sophisti- cated technologies and environmen- tal protection.


Beyond SN100C It is becoming increasingly ap -


parent that the simple ternary SAC305 alloy cannot deliver every- thing that the electronics industry requires from a solder, in terms of cost and performance. The cost of the three to four percent silver required to get the 422.6°F (217°C) solidus temperature was one of the main rea- sons for choosing SnAgCu eutectic that had reduced silver content as low as 0.1 percent, or even without silver altogether. Nihon Superior has now devel-


oped its SN100CV alloy that gains its strength from solute atoms in the tin matrix of the joint unlike silver-con- taining alloys that derive their strength from a dispersion of fine


particles of eutectic Ag3Sn. The addi- tion of bismuth enables thermally stable solder joints, even after ther- mal cycling.


Engineering... Continued from page 67


Model-Based


they are much less expensive. By also reducing design rework, data reuse minimizes costs and enables superior manufacturing efficiency. In order to survive and grow in


this challenging environment, harness manufacturers must significantly change their methods. Digitalization is a key adaptation for harness mak- ers, offering the tools needed to sur- vive in an extremely dynamic indus- try. A digital model-based flow unifies the previously fragmented domains of design and manufacturing and cap- tures tribal knowledge held by experi- enced engineers through integrated design rules. To meet the demands of an evolving industry, it is time for wire harness makers to become digital enterprises. Contact: Mentor, a Siemens


Business, 8005 S.W. Boeckman Road, Wilsonville, OR 97070 % 503-685-7000 E-mail: larry_toda@mentor.com Web: www.mentor.com r


See at SEMICON West, Booth 2335


www.us- tech.com SN100C Achieves 20 Years of Reliable Service Another product the company has developed is


the Alconano silver sintering paste, which is based on a patented technology that makes it possible to


effectively join most metals, as well as silicon and sil- icon carbide at low sintering temperatures, in nitro- gen if necessary, without the nitrous or sulfurous residues that are the byproducts of the sintering of some other nanosilver pastes. The highly active sur- face of the nanosilver particles and the consequent strong capillary forces make it possible to achieve strong bonds with high electrical and thermal con- ductivity at low temperatures, without the need for external pressure. Twenty years ago, when SN100C was invented,


it was considered to be a reliable and stable alterna- tive to SnPb solders. Now, its reputation has grown even stronger and has evolved to meet new industry challenges. Contact: Nihon Superior USA, LLC, 1395


Three generations of the Nishimura


family (from left): Takatoshi, founder Toshiro, and CEO Tetsuro.


Hawk Island Drive, Osage Beach, MO 65065 E-mail: k.howell@nihonsuperior.co.jp Web: www.nihonsuperior.com r


Vacuum Tweezer™ Solutions


For over thirty years we have been a leading supplier of vacuum handling solutions to the world’s high technology


fi rms. Our patented ESD safe products are used by clean room personnel, electronic assemblers, semiconductor manufacturers, the optics


industry and universities around the world. Virtual Industries success has come from


developing innovative vacuum tweezer tools to eliminate part damage and increase productivity in pick and place operations throughout high tech industries.. These tools provide customer specifi c solutions that make assembly and processing operations more productive and ergonomic. Parts range in size from 0.004” (0.1mm) up to 12.0” (300mm) for easy handling.


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• Portable, battery-operated continuous vacuum handling systems


• Bench top 110/220 volt vacuum tweezer systems


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Visit our website or contact us for additional information.


Page 69


30 MORE THAN


2130 Victor Place, Colorado Springs, Colorado 80915 USA Website: virtual-ii.com E-mail: info@virtual-ii.com USA Telephone: 719-572-5566 Fax: 719-572-5504


See at SEMICON West, Booth 1534


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