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www.us- tech.com


July, 2019


CyberOptics Launches New Software and MRS Sensor


Minneapolis, MN — CyberOptics® Corporation is launching its new WaferSense® Auto Vibration and Leveling Sensor™ (AVLS3) with CyberSpectrum software. Semicon - ductor fabs and OEMs value the accu- racy, precision and versatility of the WaferSense AVLS3 — an efficient and effective wireless measurement device for leveling and vibration. At only 0.14 in. (3.5 mm),


AVLS3 can travel with ease to most fab locations where a wafer travels. The chemically hardened glass (CHG) substrate enables smooth wafer handling and improved vacu- um chucking. With long-range wireless capa-


bility, AVLS3 combined with new, easy-to-use CyberSpectrum software, collects and displays both leveling


REFLOW


and vibration data simultaneously for fast equipment set up, alignment


Resolution multi-reflection suppres- sion (MRS) sensor technology that meticulously identifies and rejects multiple reflections caused by shiny components and mirror-like surfaces. Effective suppression of multiple reflections is critical for highly accu- rate measurements. Offering a combination of high


WaferSense Auto Vibration and Leveling Sensor (AVLS3) with CyberSpectrum software.


and real-time equipment diagnostics. Additionally, for mid-end and


advanced packaging inspection and measurement, CyberOptics is offer- ing its new proprietary Nano -


SEE US AT


SOLDERING SYSTEMS


SEMICON WEST BOOTH 5653


accuracy, high resolution and speed, MRS sensors are widely used for inspection and measurement in the SMT, semiconductor and metrology markets. The new 3 µm NanoRes olution


MRS sensor enables metrology-grade accuracy with superior 100 percent 2D and 3D inspection performance for features as small as 25 µm. According to the company, it is two to three times faster than alter-


nate solutions on the market. With data processing speeds in excess of 75 million 3D points per second, the NanoResolution MRS sensor delivers throughput greater than 25 wafers (300 mm) per hour. 100 percent 2D and 3D inspection can be completed simultaneously at high speed, versus an alternate, slower method that requires two separate scans for 2D and 3D, and only a partial sampling of the wafer. Contact: CyberOptics Corp.,


5900 Golden Hills Drive,


Minneapolis, MN 55416 % 952-820-5837 E-mail: cfuranna@cyberoptics.com Web: www.cyberoptics.com


See at SEMICON West, Booth 5769


HEIDENHAIN and ETEL Display Solutions for FOWLP


Schaumburg, IL — Fan-out wafer- level packaging (FOWLP) demands both a high-accuracy and high- through put motion system, especially at the wafer reconstruction process step. HEIDENHAIN and ETEL are exhibiting a variety of motion systems and encoders at SEMICON West. ETEL’s TELICA motion system


FALCON ULTRA PROFILE 1200 Small Footprint • Efficient Power Use


Consistent High Yields • Precise Temperature Gradient


is a newly developed positioning plat- form dedicated to backend semicon- ductor processes, as well as the elec- tronics market. Soon to be available, this new system allows users to han- dle the requirements of next-genera- tion, advanced packages, with a placement accuracy in the micron range. This accuracy is over a work- ing space of up to 34.25 x 31.5 in. (870 x 800 mm), allowing very high duty cycles and throughput. The NUMERIK JENA LIKgo


linear encoder is a newly designed, low-cost linear install with generous mounting tolerances, due to a new scanning technology that provides significantly improved signal quality. Measuring steps down to 78.125 nm are possible. Other advantages of the LIKgo


SIKAMA INTERNATIONAL, INC. www.sikama.com


See at SEMICON West, Booth 5653


include a very small scanning head that weighs only 0.2 oz (5g). The scan- ning technology is resistant to con- tamination, because of its dual scan- ning windows and is reliable. The electronics produce very low heat, due to low current consumption.


Another new product in the


HEIDENHAIN corporate group product portfolio is the MCR 15 absolute modular angle encoder from


ETEL TELICA positioning platform.


RSF. Developed for dynamic applica- tions in the semiconductor and elec- tronics industries, this new angle encoder consists of a scanning head and a graduation flange. The MCR scanning heads are


designed specifically for the available interfaces, as well as for the gradua- tion-flange outside diameters. They enable a measuring range of 360°. The graduation flanges are available in 10 different outside diameters within a range of 2.4 to 13.8 in. (59.9 to 350.2 mm). Contact: Heidenhain Corp., 333


E State Parkway, Schaumburg, IL 60173 % 847-490-0387 E-mail: jdoughtery@heidenhain.com Web: www.heidenhain.us


See at SEMICON West, Booth 851


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