July, 2019


www.us- tech.com


Page 27 Rehm Now Supports Hermes Networking


Roswell, GA — Fast, network-based communication between individual machines is being enabled by the Hermes Standard. This standard is designed to replace the previous SMEMA interface, in which commu- nication from individual machines was reduced to digital signals and a scanner was required in front of each machine to identify each assembly. Hermes links the individual


machines together with a direct form of horizontal communication. Data is exchanged throughout the entire SMT line, directly from machine to machine and the data packets move through the machine together with the circuit boards. The Hermes data package is ini-


tially created at the start of the pro- duction line. The barcode is printed, lasered or read in by a scanner. This data package is then communicated from machine to machine together with the circuit board. The new extension of the vertical


interface introduced with Hermes 1.2 allows the circuit boards to be tracked in a production line or provides the option of synchronizing the assem- bly’s data with an MES. This new form of interface communication uses a TCP/IP and XML-based protocol, with standardized Ethernet hardware components and a flexible data for- mat. This simplifies the integration process and reduces costs. In addition


Camalot Intros PCB Temperature Monitoring for Prodigy


Minneapolis, MN — ITW EAE is in- troducing a patent-pending option for the Camalot Prodigy dispenser that was developed to ensure process stability and increase yields for un- derfill applications. In applications where board


heat is required, a constant product temperature through the dispense process is critical to ensure process stability and repeatability. Underfill materials vary in viscosity and filler types, therefore the heat require- ment for the board also varies. The new infrared temperature


sensors measure the top-side board temperature in real time, which al- lows the system to provide closed- loop control to maintain the product within the specified temperature range. The sensors provide a closed-


loop, failsafe means to monitor and control the top-side board tempera- ture through each of the process zones (preheat, dispense heat and post-heat zones), which are typically used during the underfill process. The passive IR sensors can be


configured in any or all three convey- or zones in single- or dual-lane sys-


tems. Contact: ITW EAE, a division of


Illinois Tool Works, 8860 207th Street West, Minneapolis, MN 55044 % 952-469-8278 E-mail: roger.dullinger@itweae.com Web: www.itweae.com


VisionXP+ convection soldering system.


to the barcode of the assembly, other types of data are communicated. Rehm customers can choose be-


tween two options to add Hermes to the VisionXP+ convection soldering system: one with a scanner on the


outfeed conveyor and one without. Without the scanner on the outfeed conveyor it is not possible to manual- ly reinsert a board. This reduces the risk of data being lost or being as- signed to the wrong assemblies. If a scanner is present on the


outfeed conveyor, boards can be re- moved after soldering and reinserted as the user requires. This is particu- larly important if a visual inspection is performed manually or if random samples are to be taken for quality


assurance purposes. Contact: Rehm Thermal Sys-


tems, LLC, 3080 Northfield Place,


Suite 109, Roswell, GA 30076 % 770-442-8913 fax: 770-442-8914 E-mail: c.kramer@rehm-group.com Web: www.rehm-group.com


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