July, 2019


www.us- tech.com


Page 75 Heraeus Offers New Features for DCB Substrates


West Conshohocken, PA — Direct copper bonding (DCB) substrates are an essential component for the production of modules in power electronics. Heraeus Electronics has developed its proven Condura product line even fur- ther. Additional services include an optimized design, along with a special surface treatment to increase the service life of DCB substrates. In particular, these advances benefit automotive and industrial segments. Power electronics are already based on long-last-


ing direct copper bonding substrates. But load limits and demands on the surface structure of the substrate materials continue to grow. With two innovative serv- ices, Heraeus Electronics meets these dual needs by offering an optimized design along with a unique sur- face finish that extends the durability of the substrate. Due to so-called dimples, small etched recesses,


durability can be permanently increased. Heraeus Electronics offers various patent-free shapes and lay- outs that can be individually adapted to customer requirements. An additional service offered by


Heraeus Electronics is grinding, a special mechanical surface treatment that ensures optimized properties. The structure of the surface must be able to accommodate the formulation and bonding technique used. The company offers various degrees of roughness that reduce unevenness and ensure a fitting surface.


PI Fast Alignment Comes to


ACS Controls Continued from previous page


dynamic cross-axis control yields uniform performance over the gantry area, eliminating grid-based approxi- mation methods and their conse- quent lowest-common-denominator approach to tuning over large areas. Together, these mean higher per- formance and reproducibility. These benefits come with PI’s


and ACS’ rich offering of global sup- port options, ranging from onsite Quick Start and training, to extend- ed warranties and service plans, to consulting and co-engineering, to application and software consulta- tion and quick-port approaches for key customers transiting from other architectures. Photonics today is serious busi-


ness, with a rapid rate of innovation and churn and broad adoption by important semiconductor and net- working players. Manufacturing and testing these devices demand flexi- bility and high performance from production systems and tooling. Multiple studies have spotlighted alignment time as the highest cost contributor to photonic device fabri- cation, both from the lengthy process times formerly required and from the repeating requirement for alignment throughout the production process. PI’s revolutionary fast align-


ment technology is unmatched for meeting these challenges, and now it is deployed in large-area mechanisms based on a modular, open-architec- ture approach ideal for systems inte- gration and tooling platforms. Contact: PI (Physik


Instrumente) L.P., 16 Albert Street, Auburn, MA % 508-832-3456 E-mail: info@pi-usa.us Web: www.pi-usa.us r


See at SEMICON West, Booth 6345


See at SEMICON West, Booth 2335 Condura series DCB substrate. The new service is available for the products Condura.classic — the


proven standard for the power electronics industry — and Condura.extra, which provides improved mechanical stability, reliability and durability. The Condura family also includes Condura.prime, a sub- strate with silicon nitride ceramics. With the new service for the Condura family,


Heraeus is expanding its portfolio for applications in the field of power electronics and offers solutions for substrates, bonding wires, pastes, platinum tempera- ture sensors, and complete material systems in addi- tion to materials for manufacturing processes, such as soldering and sintering. Contact: Heraeus, Inc., 24 Union Hill Road,


West Conshohocken, PA 19428 % 215-944-9981 E-mail: jeffery.oddo@heraeus.com Web: www.heraeus-electronics.com


See at SEMICON West, Booth 5557


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