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www.us- tech.com


Royce and V-TEK Add High-Res Inspection to Die Sorter


Mankato, MN — Royce Instruments and V-TEK Inter- national have released a new defect inspection capabili- ty, which enables detection of micron-scale defects on five sides of a device. This new value-add process is de- signed to ensure zero-defect quality at the die-level for the most critical applications. Defects can be detected using multi-spectral illumination and ultra-high resolu- tion cameras to identify defects that are not detectable at the wafer level. The highly customizable AP+ offers a variety of


automated input and output options, while maintain- ing fast changeover between processes. Die input is from wafer, waffle pack, Gel-Pak, JEDEC tray, or custom tray using an input map. Output options are the same with the addition of a new tape-and-reel


system. The AP+ taper also offers an adjustable width track with heat and pressure seal options. Die Sort Manager software provides input-to-out-


put traceability at the die level. Die Sort modes include pizza map or reticle mask wafer mapping, ink dot recognition and pick all die. AP+ options include non- surface die pick-up, 180° die flip and taper post-place vision inspection.With its multi-project wafer map- ping capability and quick-change fixtures and tooling, the AP+ is excellent for supporting medium-volume,


DB8989 epoxy resin. NIKON X-RAY Revolutionizing Electronics Inspection


• Nikon proprietary x-ray source with unlimited life cycle


• Advanced semi-sphere imaging range: 81° oblique viewing on any 360° rotational angle over entire tray surface


• Up to 3600x of geometric (non-digital) magnification • High-Grade Amorphous-Silicon Digital Detector with true 16-bit Analog to Digital Converter


• Largest field-of-view detector in the industry (10” x 8”)


• 3D CT and 3D Laminography reconstruction


• Available in 130 kV and 160 kV 3D measurement analysis including inspection of obstructed BGAs


Non-magnetic test socket Loranger non-magnetic sockets


are available for –67 to +482°F (–55 to +250°C) applications, and in solder- free compression mount and plated through-hole styles. Loranger non- magnetic sockets use components that are optimized for non-magnetic appli- cations. Non-magnetic socket designs are also available with user-removable and interchangeable magnets which can be used to create various magnet- ic test conditions. Loranger has more than 35


years of experience in manufacturing sockets, printed circuit boards and environmental test chambers for the test and burn-in industry. Over 3,700 socket designs are available, includ- ing QFN, BGA, LGA, SMD, and gull


wing styles. Contact: Loranger Intl. Inc., 303


Brokaw Road, Santa Clara, CA 95050 % 408-727-4234 fax: 408-727- 5842 E-mail: sales@loranger.com Web: www.loranger.com


www.nikonmetrology.com sales.nm-us@nikon.com See at SEMICON West, Booth 5745


1 (800) 552-6648


See at SEMICON West, Booth 931


Mankato, MN 56001 % 507-345-0128 E-mail: mwilson@royceinstruments.com Web: www.vtekusa.com


high-mix environments. Contact: V-TEK, Inc., 751 Summit Avenue,


See at SEMICON West, Booth 5760


Loranger: Test and Burn-in Sockets for Electronic Packages


Santa Clara, CA — Loranger Intl. Corp. (LIC) is exhibiting a lineup of test and burn-in sockets for electronic packages at SEMICON West 2019. The company will be showcasing test and burn-in sockets, including non- magnetic sockets, at SEMICON West.


July, 2019


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