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tech.com
July, 2019
SHENMAO: Water-Soluble Ball-Attach Flux and Solder Sphere
San Jose, CA — SHENMAO America, Inc., has introduced SMF-WC53 water-soluble ball-attach flux and sol- der sphere for use in ball-attach processes. With excellent solderability and high reliability, the new solder sphere can be used in a wide range of solder applications with various sizes from 2 to 30 mil (50 to 760 µm). As the last process step in form-
ing electrical and mechanical connec- tions, the ball-attach process has an important impact on the overall product yield and cycle time. The in- dustry’s most popular ball-attach technology involves using paste flux and a solder sphere. SHENMAO of-
fers industry-leading fluxing technol- ogy to ensure effective assembly. SMF-WC53 flux is a halogen-free,
water-soluble flux designed for use in ball-attach processes. This flux is also excellent for printing and transferring applications as it offers solderability on all substrate surface finishes. In addi- tion, SHENMAO’s high-reliability se- ries solder sphere provides providing
thermal and impact reliability. Contact: Contact: SHENMAO America, Inc., 2156 Ringwood Av-
enue, San Jose, CA 95131 % 408-943-1755 fax: 408-684-5477 E-mail:
usa@shenmao.com Web:
www.shenmao.com
Nano Dimension Shortens PCB Assembly Times
Ness Ziona, Israel — Nano Dimen- sion has used its DragonFly Pro ad- ditive manufacturing systems to drastically reduce assembly times for BGAs and other SMT components — from days to one hour. In a recent qualification study,
DL Technology has been the leader in micro dispensing technology for over 15 years. For more
www.dltechnology.com 216 River Street, Haverhill, MA 01832 • P: 978.374.6451 • F: 978.372.4889 •
sales@dltechnology.com
the company’s application engineer- ing team demonstrated the role of the DragonFly Pro. Typically, the process from initial design through printing, soldering, manufacturing, assembly, and reflow takes weeks to complete. With a special layout structure that can only be achieved through additive manufacturing, there is no need for special tooling for assembly. This enables in-house manual assembly of BGAs and SMT components during the design and application development phase. The in-house approach enabled
by the DragonFly Pro eliminates all the stages of ordering and delivering
assembled PCBs from external sup- pliers and enables companies to do a lot more tests and feasibility studies that would not be possible without in-house additive manufacturing of electronics.
DragonFly Pro 3D printer. With existing practices, making
needed design changes is tedious, as it involves back-and-forth communi- cation between different suppliers, often leading to delays, creating diffi- culties in predictive development times, and putting the BGAs at a higher risk for errors. The DragonFly Pro 3D-printed
socket structure even improves mounting accuracy of the BGA com- ponent since there is less risk that
the mounting position will shift. Contact: Nano Dimension, Ltd.,
2 Ilan Ramon Street, Ness-Ziona Science Park, Ness Ziona 7403635, Israel % 972-452539495 E-mail:
galit@nano-di.com Web:
www.nano-di.com
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