July, 2019
www.us-
tech.com
Page 57
Microdispensing: A Solution for Semi- and Fully-Automated Production Lines
By Melanie Hintereder, Marketing, ViscoTec Pumpen- u. Dosiertechnik GmbH
ic components. This includes several methods: l
M
icrodispensing adhesives, sealants, pot- ting compounds, or thermal pastes can increase the life of a variety of electron-
Conformal coating protects PCBs from humidi-
ty, contamination from dust or chemicals and from temperature fluctuations. It can also increase reliability and electrical characteristics.
l In bonding applications, microdispensers
must offer stable dispensing. On one hand, the bonding must resist external environmental influences, such as wide temperature varia- tions, vibration or moisture. On the other hand, adhesive residues on the edges or overflowing adhesives between two assembled parts are unacceptable.
l Optical bonding eliminates the gap
between the glass and display of a smartphone or tablet. The main goal is to improve outdoor performance of displays.
l In dam and fill applications, a high- viscosity barrier, called the “dam” is
Glob top application with a preeflow dispenser.
the selection of the suitable dosing material. It should also enable uncomplicated processing through maximum process reliability. How should the dosage equipment be
designed for high-viscosity, abrasive and shear- sensitive fluids to be processed reliably, and at the same time be able to tolerate changes in the flow behavior of these fluids? Progressive cavity technology combines the
ability to feed the material with low wear, as well as low friction, providing long life and high energy efficiency.
Continued on page 59
Thrives on a Challenge. Loves Variety. The ultimate multi-process inspector for paramount speed, accuracy and ease of use.
AOI Microdispensing system.
applied to the surface to be sealed. Then, the area inside the barrier is covered with a filler. The primary goal is to protect highly complex assemblies.
l Glob top potting protects sensitive
components, usually semiconductor chips, from mechanical stress, such as vibration or fluctuations in tempera- ture. It also keeps components safe from external environmental factors, such as moisture or corrosion. These applications use a fluid resin matrix, mostly an epoxy resin adhesive.
l For underfill applications isotropic
conductive adhesives are usually used. The adhesive creates the electrical connection between the microchip and the substrate. As this adhesive is not applied over the entire surface, once it has cured the hollow space needs to be refilled, or “underfilled.”
l Microdispensing means dispensing
volume ranges starting from 0.001 ml. Whether bead dosing, sealing, dot dosing, potting or two-component applications — precision, repeat accu- racy and reliability is essential. ViscoTec handles low- to high-viscosi- ty fluids and pastes with a repeatabil- ity higher than 99 percent.
l Encapsulating means that an elec-
tronic potting compound is applied to a previously determined surface. It pro- tects the component during transport and against external influences like vibrations, impacts, moisture, dust and extreme temperatures. The compound not only protects, but also improves electrical insulation and safety against damage and chemical resistance.
The automated application of
various viscous materials should pro- vide as much flexibility as possible for
See at SEMICON West, Booth 5769
SQ3000™ All-in-One Solution Loaded with Powerful Tools that cover Inspection and Measurement for AOI, SPI and CMM.
Fast and highly accurate, repeatable and reproducible measurements for metrology applications in the manufacturing of a wide variety of products such as PCBs, semiconductors and consumer electronics.
The SQ3000™ offers unmatched accuracy with the revolutionary Multi-Reflection Suppression (MRS) technology by meticulously identifying and rejecting reflections caused by shiny components. Effective suppression of multiple reflections is critical for accurate measurement, making MRS an ideal technology solution for a wide range of applications including those with very high quality requirements.
SPI
CMM
www.cyberoptics.com Copyright © 2019. CyberOptics Corporation, Inc. All rights reserved.
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