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www.us-
tech.com
July, 2019
Optimized Reflow Profiling to Minimize Voiding
Continued from page 56 Manufacturing Inc.
www.jstmfg.com
MEMS
Whether proving out a process with a manual tool or optimizing a tool using semi-automated to fully au- tomated wet process equipment let JST’s experienced to meet your needs. Accessory equipment is also avail- and waste systems.
sales@jstmfg.com phone 208 377 1120 See at SEMICON West, Booth 1851 ULTRA COMPACT X-RAY SYSTEM
• MEDICAL DEVICES
• BGA • QFN • LED
Oven zone set points and conveyor speed changes automatically suggested by software.
board is critical. Software is also available to assist with this. The two most common settings
for establishing a recipe for a good reflow profile are the zone set points and the conveyor speed. With software, one can easily control what may or may not change, including optimiza- tion with the fastest belt speed for high throughput or least amount of zone set points for faster changeover. Having the ability to build a
reflow profile around the entire pop- ulated PCB is critical to achieving the solder paste recommendations, maintaining the component specifi- cations and reducing voiding. Software can display the results of each thermocouple as they relate to each designated process window. A software with a quick tool for estab- lishing a process window for each thermocouple can force the predic-
Most companies have thermal
profilers in their factory. Users should find out what features the software offers and how best to use it. Thermal profiler suppliers can assist with the newest available systems. Finally, industry veterans should
share their knowledge. An internal knowledge library is a great way to document experience and save it for the next generation. A reference guide allows the next person who comes across an issue that has already been solved to save time on a solution, rather than starting from scratch. In conclusion, a key focus to
reduce or eliminate voiding is the reflow profile, including a longer TAL and higher peak temperature. Solder paste specifications are guide- lines only. It is imperative to take the entire assembly into consideration when establishing the correct recipe
cantly reduces the amount of time needed, including the amount of trial-and-error thermal profile runs. Using thermocouples correctly to gain a good representation of the
assembly. Know where the ground planes are, where there are top and bottom components with different heat tolerances, etc. The oven’s capa- bilities must be known, along with its limitations.
Glenbrook Technologies, Inc.
Rotator
Positioner
Oven zone set points and conveyor speed changes automatically suggested by software.
tion software to look for an oven recipe that results in an in-spec pro- file for all the TCs automatically.
Glenbrook Technologies is Celebrating its 35th Year in Patented X-ray Technology
Knowledge is King The fastest and easiest way to
optimize a PCB profile for void reduc- tion is with knowledge. Too often, an operator might have a voiding prob- lem, call their solder paste company and when asked what the thermal profile is, respond with, “I didn’t pro- file.” A problem cannot be resolved with no information. Analyze the layout of the PCB
for the desired profile. Fine-tuning a profile for specific components should be considered. TCs on void- susceptible components should be included when profiling. TCs should also be balanced across components and PCB challenges. Finally, there are many available tools to improve the time and accuracy of finding an optimal profile. Contact: KIC, 16120 W.
Bernardo Drive, San Diego, CA 92127 % 858-673-6050 E-mail:
mballen@kicmail.com Web:
www.kicthermal.com r
Custom
Configurations Available
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