July, 2019 Continued from previous page
our growth curve. Tiny little microBGAs, bot- tom-terminated components that have to be placed onto barely-visible pads, being able to screen print onto boards with deposits that are really hard to see without a microscope and then putting the parts down on the board and knowing they’re where they’re supposed to be — it’s tough. This is, in fact, why we recently selected the E by DEK screen printer and the E by SIPLACE place- ment platform.” Investing in the most capable equipment
platforms has been a Laritech philosophy from the beginning. Bill recalls that the third machine the company bought was a SIPLACE pick-and-place system and, he says, “We’ve been on the ASM team ever since.” But, tech- nology capabilities change and the previous- generation SI PLACE platforms at Laritech, while still workhorses, were designed well before a lot of miniatur- ized parts were online so they simply do not have the parts range of the newer systems. The company’s volume growth
and need for capacity and capability expansion ultimately resulted in a new E by DEK screen printer and three inline E by SIPLACE pick-and- place machines; one equipped with a CP14 placement head, the second system with a CP12 placement head, a third with a CP12/PP placement head and a JEDEC tray feeder at the end of the line — delivering a combi- nation of speed, accuracy, flexibility and a wide component range from 01005s (0402 metric) up to parts measuring 1.8 x 3.9 in. (45 x 98 mm). “Even though we have a history
with ASM, we did our due diligence, looked at other suppliers, but nothing came close to the capability-to-price ra- tio,” Bill explains. “We’d have to spend twice as much on another manufactur- er’s highest-speed, highest-end prod- uct to get the performance we have with the E by SIPLACE platforms.”
The Performance Factor The single biggest requirement
was the component range and the ac- curacy required for that range. Now that the printer and placement sys- tems have been running in produc- tion for several months, Laritech’s evaluation has validated the invest- ment, as Joel explains: “Simply put, the machines rock. They just run, they’re fast, super-reliable and in- sanely quiet.” Recently, a 2,000 rigid- flex board build with a variety of com- ponents, including 0201s (0603 met- ric) to micro-BGAs, had a yield of 99.9 percent. “The only part that failed was a micro-BGA and that was a component issue, not a processing problem. That’s an amazing result — I was elated.” Building high-value, high-relia-
bility defense and aerospace boards, fail-safe medical electronics and countless consumer products demands dependability, flexibility and preci- sion. The throughput, process capabil- ity and reliability of the ASM equip- ment have exceeded expectations, says Joel. “The data coming out of the 3D SPI behind the E by DEK printer is phenomenal. The accuracy of the printer versus our old printer is on the order of three or four times better. I honestly didn’t know Cpk data could get as good as this printer data gets.” Commenting on the placement
performance, Terry shares similar views. “The reliability of the E by SIPLACE machines is exceptional.” So far, Laritech has not had any down- time for maintenance, no production
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stops for valve cleaning, and has relished the simple set up and very fast changeover. In an operation that might run one product for a week on a particular line or have three jobs in a day, flexibility is essential. “We need sys- tems that can adapt to our dynamic environ- ment and changeover is an important consid- eration. We set up everything on offline feeder carts and when the current job is done, we change out the feeders in a few seconds, down- load the program and we’re off and running.” Changeover speed has also been im-
E by DEK and E by SIPLACE systems give Laritech the speed and capability needed for complex product builds.
proved by the capability of SIPLACE Pro soft- ware on board the E by SIPLACE platform and, specifically, the component teach func- tion. As Joel explains, this feature is a time- saver. “We can teach component shapes on the machine,” he says, “in contrast to old tech-
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