Page 28 Strong Foundation
Janome robots provide a solid foundation for your dispensing
automation.These solutions are designed in support of your dispensing needs, utilizing all that we have learned over the last 20+ years. Choose from 3-axis and 4-axis models with the ability to add a 5th & 6th axis.
Supports syringe, jetting, and 2-part meter/mix applications. Finally, you can purchase it all from a name you trust.
www.us-
tech.com
July, 2019
Indium Launches Low Temperature Solder Paste
Clinton, NY — Indium Corporation has released a new, low-temperature solder paste, developed specifically to minimize solder beading and solder balling. Indium5.7LT-1 is an air reflow,
• • •
Made For Your Dispensing Needs
halogen-free, no-clean solder paste designed for low-temperature assem- bly processes using indium and bis- muth alloys. Indium5.7LT-1 is engineered
with a balanced set of properties for outstanding printing and soldering, including: low-temperature reflow; clear post-reflow flux residue; high transfer efficiency and low variation; excellent response-to-pause; low- voiding in bottom termination com- ponents; and excellent wetting. Indium5.7LT-1 is halogen-free
• 1K Syringe • Jetting • Spraying • 2K Mixing • UV Curing
’
per the EN14582 test method. It joins Indium Corporation’s versatile, high-performance, low-voiding solder pastes designed to accommodate a variety of industry requirements with lead-free, halogen-free, and no- clean options.
Indium5.7LT-1 solder paste. Contact: Indium Corp., 34
Robinson Road, Clinton, NY 13323 % 315-381-7524
E-mail:
abrown@indium.com Web:
www.indium.com
EMS: Snap-Cure, Low-Cost Conductive Adhesive
Delaware, OH — Engineered Materi- al Systems, Inc. (EMS) is now offer- ing its CA-150 series snap-cure, low-cost conductive adhesive for stringing and shingling crys- talline silicon and heterojunc- tion solar modules. The EMS CA-150 series is
designed for use in modified rib- bon stringers. The material will snap cure and fixture cells and ribbons in seconds at 302°F (150°C) with enough strength to withstand the module manufac- turing processes until the adhe- sive cure is completed during the en- capsulant lamination process. EMS CA-150 series conductive
adhesives can be dispensed by time- pressure, auger or jetting. The adhe- sive is more stress absorbing than solder to withstand the rigors of ther- mal cycling and processes at lower
temperatures than solder. CA-150 series conductive adhesives are less
EMS CA-150 series conductive adhesive.
than half the cost of pure silver-filled
conductive adhesives. Contact: Engineered Materials
Systems, Inc., 100 Innovation Court,
Delaware, OH 43015 % 925-337-9061 E-mail:
mfrancis@emsadhesives.com Web:
www.emsadhesives.com
See at SEMICON West, Booth 6261
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