news digest ♦ Equipment and Materials


lab-scale equipment, we bring a breadth and depth of process experience that is unequalled by any other company,” boasts Farrar.


There are three new semi-automatic thin wafer handling tools manufactured by Brewer Science for CS processing applications.


The first is the Cee 1300CSX thermal debonder, which enables high-temperature slide-off debonding of thinned III-V and CS materials including GaAs, GaN, InP, and SiC, in a confidential laboratory setting.


Megasonic Developer/Cleaner; Cee 300MXD Semiautomatic Benchtop Debonder ; Cee 1300CSX


The ZoneBOND separation tool has been enhanced with compliant seal clamps and fail-safe abort hardware to accommodate thinned III-V and CS materials. Brewer says the its latest product provides superior precision control for debonding materials that are highly sensitive to mechanical and thermal shock, flexibility for sizes ranging from 2 inches to 300 mm, and very-low-stress room temperature debonding.


The main problem is total cost of ownership. Established MOCVD makers all have technology roadmaps to enable COO reduction by three or four times within the next 5 years through a combination of improved yields, throughputs and precursor utilisation efficiency.


ZoneBOND Separation Tool


The final product is the Cee 300MXD megasonic cleaning system, which applies uniform acoustic energy to spinning substrates to gently remove adhesive residues and contaminants without damaging fragile device structures.


For MBE, Yole says Riber and Veeco are the only two players offering large capacity / large throughput MBE production tools for volume manufacturing. The market research firm expects both firms will maintain their dominant positions. However, there are about ten other MBE manufacturers offering R&D or pilot production systems that also have a strong presence on the general MBE market, such as DCA, SVT and Eiko.


The Metal Organic precursor market will also be driven by LED applications. But MOCVD reactor technology improvements, including yield, consumption and wafer size, will lower the amount of TMGa and TMIn needed per cm² of epiwafer.


The 2010 metal organic shortage ended in mid 2011 thanks to aggressive capacity expansion by leading suppliers. Further capacity expansion plans from established and emerging


166 www.compoundsemiconductor.net April/May 2012


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