Equipment and Materials ♦ news digest operating in.”
“Furthermore, we have significantly enhanced our existing product portfolio over the last 18 months, so that we are confident of being highly competitive in the event of a sudden upturn of demand in the market. Additionally, despite the very volatile current economic environment, we have more than just sustained our MOCVD R&D efforts, we have accelerated our investments into both next generation MOCVD products and other ‘Beyond LED’ products that we believe are necessary to support our longer-term ambitions.”
Outlook
Order intake visibility has not improved to the point where Aixtron Management can yet predict a full year revenue figure. Nevertheless, the Company still targets to remain EBIT profitable in 2012 under the current circumstances. On a more positive note; there continues to be solid evidence of emerging new LED lighting product developments, increasingly proactive government engagements and clear company positioning investments.
Successful Oxford
Instruments seminar held in Shanghai
Presentations held during the one day program included topics such as Atomic Layer Deposition, Photovoltaics, Deep Silicon Etch and Ion Beam technologies
The recent Nanoscale Plasma Processing Seminar organised by Oxford Instruments in Shanghai attracted over 70 attendees from both academia and production, from China and Taiwan.
The company organises these events worldwide several times a year, and has previously co-hosted with organisations such as the IOS-CAS in Beijing, LBNL, Caltech and Cornell in the USA, Universities of Southampton and Glasgow in the UK, and TU/e in the Netherlands.
As a supplier of systems and processes for plasma etch and deposition, the company was honoured that so many invited guest speakers participated, all specialists in their field from China, Taiwan and Europe. Process and Applications experts from Oxford Instruments Plasma Technology gave a number of talks on the company’s technologies and process solutions.
These events aim to encourage interest in developments within industrial and research communities using Plasma and Ion Beam Etch and Deposition process techniques. They are an ideal means for participants to learn more about latest techniques and findings in an informal atmosphere where participation and interaction are encouraged.
Talks included topics such as Atomic Layer Deposition (ALD), Photovoltaics (PV), Deep Silicon Etch and Ion Beam technologies during the one day programme.
Guest speakers included: Erwin Kessels, from University of Eindhoven (TU/e), Netherlands; Chu Ann-Kuo, Department of Photonics, National Sun Yat-sen University, Taiwan; Zhenghua YE, SITP (Shanghai Institute of Technology Physics); Juncong SHE, Sun Yat-Sen University, China; and Jerry Wang, Manager of Microsystems Technology Centre, ITRI, Taiwan.
Mark Vosloo, Sales, CS and Marketing Director, Oxford Instruments comments, “We were pleased to have attracted such a large and high calibre audience to this Seminar in Shanghai, and are extremely honoured that so many distinguished guest speakers gave their time to speak about their work in Plasma Processing. Our Seminars offer a fantastic opportunity for the wider Plasma Processing community to meet and share their experiences, and to learn more from leading international experts in their field.”
Oxford Instruments is planning more seminars worldwide for 2012.
Innovative thin wafer handling for CS device processing
Brewer Science is introducing a thermal debonder, an enhanced ZoneBOND separation tool and a cleaning system for III-V compound materials such as gallium arsenide and nitride, indium phosphide and silicon carbide
Brewer Science has unveiled new processing equipment specifically designed for thin wafer separation and post- debonding cleaning of compound semiconductor materials.
These steps are critical for ultrasensitive compound semiconductor (CS) device processing.
Brewer says these latest tools enable thin wafer handling technologies and broaden the process window and lower total cost of ownership by reducing yield loss and increasing throughput.
“Brewer Science Cee lab-scale processing equipment offers track-quality precision and is suitable for low-volume prototype processing that enables transfer to high-volume manufacturing,” says Wayne Farrar, Director of Equipment.
Oxford Instruments thanking their guest speakers for assisting in making the Shanghai Seminar such a success
“No other company is as uniquely positioned as Brewer Science to offer complete solutions for your thin wafer handling needs. With our temporary bonding materials and
April/May 2012
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