news digest ♦ compound semiconductor ♦ industry news
Luminus Awarded DOE Grant to Develop Driver Electronics for High Power LEDs
The primary objective of the Phase 1 grant is to bring big-chip solid-state lighting solutions to world markets more rapidly and at lower costs with energy efficient electronics.
Luminus Devices, a developer and manufacturer of high light output LEDs has been awarded a grant from the U.S. Department of Energy’s (DOE) Office of Science.
The firm will develop low cost, high efficiency drive electronics to enhance its big-chip LED technology for use in next-generation, solid-state light sources and fixtures in commercial and industrial buildings as well as residential applications.
Luminus was awarded the Phase 1 grant under the DOE’s Small Business Innovation Research (SBIR) Program. The primary objective of the SBIR grant is to bring big-chip solid-state lighting solutions to world markets more rapidly and at lower costs with energy efficient electronics.
“Luminus develops the world’s brightest single element, solid-state light sources. We are thrilled to be working with the DOE to expand the global reach of PhlatLight LEDs into untapped environments,” said Keith T. S. Ward, president and CEO, Luminus Devices.
“In 2012, many traditional light sources will begin to be phased out as part of the Energy Independence & Security Act of 2007, and will be replaced with next-generation, long-lasting, energy-efficient solid-state light sources. The DOE award is further validation of Luminus’ LED solutions that bring value and new designs to the North American lighting market,” he continued.
Designed to provide an ultra-bright, reliable light source, Luminus LEDs are used in lighting applications by many of the world’s largest electronics and lighting companies. Luminus’ products are enabling new general illumination applications in lighting markets such as architectural, entertainment, retail, residential, roadways, industrial high-bay lighting, digital
76
www.compoundsemiconductor.net October 2010
displays and signage and UV for industrial processing.
Sensor and Materials Technology Patents to Be Sold at Auction
The lots include mass flow control technology and the use of AlN in thin-film structures for oxidation protection and electrical insulation.
Heetronix, a Reno Nevada based sensor technology company, will sell at auction 30 US and foreign patents encompassing sensing, heating and materials technology in seven lots. The contents in each lot can be accessed online at www.ipauctions. com .
All lots contain direct links to the information on the USPTO website about the patents and patent applications as they are filed or approved.
The largest lot contains six US and eight foreign patents plus two US patent applications, which encompass temperature sensors and probes, thin-film heaters, and thin-film circuit structures and materials. The temperature sensor market is estimated at approximately $4 billion.
Ten patents covering infrared radiation absorption by silicon carbide and the acoustic absorption mechanism of silicon carbide are in the second largest lot. Additional lots cover the properties of materials combinations for high temperature, thermal shock resistant, hybrid-circuits, and hybrid- circuit encapsulation.
Additional lots include: (1) surface mount rework structures to pick and place and simultaneously heat surface mount devices with thin-film heaters, where the heaters measure their own temperature – this market is greater than $1 Billion; (2) mass flow control technology; and (3) the use of AlN in thin- film structures for oxidation protection and electrical insulation.
All seven of these lots are scheduled for auction from noon PDT on October 11th through noon PDT on the 14th.
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120 |
Page 121 |
Page 122 |
Page 123 |
Page 124 |
Page 125 |
Page 126 |
Page 127 |
Page 128 |
Page 129 |
Page 130 |
Page 131 |
Page 132 |
Page 133