April, 2011
www.us-
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Page 73 Nihon Superior: Advanced Soldering Materials
Osaka, Japan — Nihon Superior Co. Ltd. is showcasing its SN100C P602 D4, a completely halogen-free, lead- free solder paste, which contains no intentional addition of the halogens F, Cl, Br or even I hidden in the chem- istry. The silver-free alloy delivers a stable microstructure in an alloy that can accommodate the long-term cyclic strains and impact loading to which a solder joint can be subjected. The paste produces fillets that
are smooth and bright with few shrinkage defects and a stable microstructure with minimal growth of interfacial intermetallics, resulting in highly reliable solder joints. According to the company, SN100C P602 D4 provides excellent printing and reflow in fine-pitch circuitry, low hot and cold slump, and good coales- cence and wetting with no solder balls. Two variations are SN100C
P603 D4 and SN100C P605 D5/D6 dispensing grade are likewise com- pletely halogen-free lead-free solder pastes and offer superior dispensing stability, which ensures no skipped pads. SN100C P605 D5/D6 is opti- mized for high precision dispensing for chip components down to 01005 (0402 metric). Because they are com- pletely halogen-free, these pastes help to achieve improved reliability, high productivity and cost reduction. Flux-cored solder wire SN100C (044) is a completely halogen-free
Kyzen Shows Electronics Cleaning
high-performance solder that makes it possible to achieve a high first pass yield because of its excellent wetting
and spread, while providing an approximately 30 percent faster sol- dering speed in manual soldering operations when compared to the company’s previous halogen-free flux-cored solder wire. A robust, heat resistant, no-
Lead-free solder paste.
clean, rosin-based wave soldering flux, NS-F900, is completely halogen- free. It provides high performance with high temperature preheat pro- files, allowing high topside board temperatures up to 125°C and the long contact times that may be required for thick boards and dense, complex assemblies while remaining environmentally friendly. The flux is specifically designed for use with
SN100C (Sn-Cu-Ni+Ge) lead-free sol- der but works well with all solders, both lead-free and Sn/Pb. NS-F900 has been formulated
to provide good hole-fill and easy sol- der joint inspection with minimal residue, while meeting JIS and J- STD-004
Surface
Resistance requirements. The excel- lent drainage promoted by NS-F900 results in reduced bridging. Contact: Nihon Superior Co. Ltd., NS Bldg., 1-16-15 Esaka-Cho, Suita City, Osaka, 564-0063 Japan % 81-(0)6-6380-1121 fax: 81-(0)6-6380-1262 Web:
www.nihonsuperior.co.jp
See at APEX Booth #259. Insulation
Chemistries Nashville, TN —Kyzen is showing its extensive line of cleaning technolo- gies developed to meet the increasing demand for advanced cleaning chemistries. New electronic devices and assemblies provide better yields and lower failure rates after clean- ing, and after many years of exten- sive R&D efforts, the company is now meeting this demand to supply a suitable cleaning product at any
Cleaning a PCB.
point in the manufacturing process where cleaning is necessary. Kyzen’s cleaning chemistries
have not only been proven to perform wherever they are used, but also are award-winning products that are eco-friendly, cost-effective and easy- to-use. The company continually tests its products against the latest soils in every aspect of manufactur- ing and strives to continually improve products to address current and future cleaning issues such as white residue, more densely populat- ed boards and environmental con- cerns and restrictions. Contact: Kyzen Corporation, 430
Harding Industrial Drive, Nashville, TN 37211 % 615-831-0888 fax: 615- 831-0889 E-mail:
info@kyzen.com Web:
www.kyzen.com
See at APEX Booth #1439. See us at APEX Booth 1725
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