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www.us-tech.com Selective Soldering Equipment Continued from previous page
Special emphasis needs to be given to the need for efficient and capable solder delivery and inert
path. A nitrogen flow monitoring sys- tem provides accurate solder pot capacity information, which is then used to initiate and control solder
lead-free solders, they still have wet- tability and bridging issues that make them more difficult to work with than traditional tin/lead solders in wave and selective soldering systems, and fine-pitch spacing only exacerbates them. Tight spaces, small gaps between adjacent components and very fine pine pitch devices drive the need for a nitrogen peel-off jet, a direc-
tional jet of pre-heated nitrogen (N2) which assists in minimizing the accu- mulation of solder on specific solder joints that might be more susceptible to accumulation because of design or configuration. By applying a jetted
pulse of N2 at a critical moment in the soldering process, the resulting sur- face will be wetted with the minimal amount of solder required for a quali- ty solder joint.
Dropjet Fluxers Dual-head spray fluxer.
atmosphere control, both of which are essential for good lead-free selec- tive soldering. Look for features including a nitrogen flow monitor that uses nitrogen pressure levels to indicate the level of solder in the sol- der pot, and a super-heated nitrogen
replenishment to keep the pot sur- face exactly level for high repeatabil- ity and process stability.
A nitrogen peel-off jet improves fine-pitch selective soldering results. Even though significant advances have been made in the metallurgy of
A dual-head fluxer option facili- tates quick changeover of flux types. Dual flux heads usually involve one spray head and one drop-jet fluxer. A dual head fluxer is especially designed to meet the needs of selec- tive soldering applications that demand quick changeover from lead- ed to no-lead solders. The addition of a dual-head fluxing system makes it possible to change flux types quickly. Drop-jet spray head technology allows the generation of a large num- ber of drops with a well-defined size; these types of fluxers are especially useful for applying precise amounts of flux to very small areas. Use of the drop-jet is mandatory for top side fil- lets (Class III) on thicker boards with high copper content. Since the flux is forced to the top side of the board,
April, 2011
preparing the surfaces for solder to follow.
Swappable Solder Pots
When looking at smaller selec- tive soldering units with smaller sol- der pots or those of a manageable size, quickly swappable solder pots can be a major time-saving advan- tage for assemblers (such as EMS) who alternately may be manufactur- ing both lead-bearing and lead-free assemblies. This feature is especially suitable for companies that do not have enough volume to warrant pur- chase of separate, dedicated selective soldering machines for both lead and lead-free soldering. Larger nozzles — typically 3-in.
(76mm) — can increase throughput as well as close the gap between selective, or secondary soldering, and full wave soldering. The 3-in. wave enables the quick conversion from a leaded solder- ing process to a no-lead solder process. By “painting” the solder side of a circuit with the 3-in. wide wave, a selective soldering machine can deliver produc- tivity that approaches that of the stan- dard wave soldering tools commonly available.
Certainly there are many other options and features available on various machines for the prospective user to choose from, but these are a few of the more significant ones that can enhance productivity and extend the range of applications to which the selective soldering system may be applied. Contact: ACE Production Technologies, Inc., 3010 N. Industrial Park, 1st Street, Spokane Valley, WA 99216 509-924-4898 E-mail:
ACable@ace-protech.com Web:
www.ace-protech.com
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