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tech.com
April, 2011
Flexible SMT Placement Systems from Europlacer
Tampa, FL — Europlacer’s iineo plat- form adds many enhancements to the company’s machine range, such as a high feeder count, increased board size and increased maximum compo- nent height. The platform uses the company’s proven core features, which include turret head, intelligent feeders and powerful software, while introducing such technologies as lin- ear motors and digital cameras. The placer is widely config-
Maintain your ESD program with Staticide topicals or ESD Safety Shield.
Two types of coatings to cover your needs: biodegradable topicals and stable coatings. Staticide topicals eliminate static and prevent tribogeneration while Staticide ESD Safety Shield maintains resistivity by dissipating static at a safe rate.
For details and ordering instructions for these user-friendly and highly effective coatings for plastic from the nation’s most reliable producer, visit our website.
www.aclstaticide.com
With Staticide protection, you’re in charge!
urable, allowing for numerous differ- ent combinations: single or dual lin- ear motor gantry including a rotary turret head with eight or 12 pickups; one or two board positioning mecha- nisms; oversized board options; huge feeder capacity to front and rear, or front only. The dual-head iineo-II VLB is
the latest enhanced addition to the Europlacer product portfolio, de signed for the growing LED assembly seg- ment. The assembler can accommo- date PCBs as large as 24 x 63-in. (610 x 1600mm), making it especially suit- able for handling LED form factors, particularly industrial fluorescent lighting. The VLB transport system can be quickly/easily converted to han- dle large, typical sized PCBs up to 18 x 20-in. (457 x 508mm). The XPii-II is a new approach to
When it comes to static protection, Staticide has you covered.
modular pick-and-place, incorporating technology from the company’s inno- vative iineo platform. XPii benefits from low-maintenance linear motors, high-resolution digital cameras and advanced on-head optical component sensing. XPii-II features two place- ment heads and uses the company’s proven core features — turret head, intelligent feeders and powerful soft- ware. It is equipped with a choice of turret heads and incorporates optical sensors that can detect on-the-fly, the presence of components as small as 01005 and as large as 4-in. (101mm) long connectors. XPii-II will accommo- date components supplied on tape,
Quick-Turn Prototyping Advanced Packaging Services
Pac Tech USA Bumping Facility
• ISO-9000 and ITAR Certified • Quick-turn prototyping • Wafer and single chip bumping • Low-cost electroless nickel UBM
• High-speed maskless wafer solder balling (jetting) • CSP and BGA substrate bumping and reballing • High-speed wafer and ceramic dicing • Wafer repassivation and redistribution • Low stress wafer thinning • Laser backside marking • Electrical testing
• Lead-free, high-lead, eutectic SnPb, AuSn, and low-alpha solders
• Solder ball size capability: 60µm to 760µm Certified ITAR Complete Wafer Level Backend Services High-Speed Die Sorting
• Die size: 0.5 x 0.5mm – 25.4 x 25.4mm • High-speed: > 6000 UPH • Optical inspection (AOI) • Inked die or wafer map capability
ISO 9000 Certified
High-Speed Solder Jetting • Maskless bumping for single die, wafer, CSP and BGA
High-Accuracy Wafer Dicing • 300mm wafer diameter • Bumped and non-bumped wafers • Silicon, GaAs, GaN, and ceramic • High quality through double-cut • Minimum sawing street: 60µm
Low-Stress Wafer Thinning • Bumped and non-bumped wafers • 200mm wafer diameter
• Final minimum thickness: 100µm Booth 2218 328 Martin Avenue • Santa Clara, CA 95050 • T: 408-588-1925 • F: 408-588-1927 • Email:
Sales@PacTech-USA.com www.pactech.com See us at APEX Booth 2218
Visit us at APEX
Precision rework system. An in-site process observation
camera allows the ability to view the reflow process from almost any angle. The unit’s core represents a compact, yet versatile hot-gas rework system with a level of professional- ism that exceeds its attractive price. The system integrates the com-
plete rework cycle into an efficient design without diminishing function- ality. It core handles de-soldering, site dressing/solder removal, paste print, re-balling and component replacement in one integrated plat- form. The unit is driven by sophisti- cated integrated thermal manage- ment and the new QuickStart Profile Library. Contact: Finetech, 8380 S.
Kyrene, Ste. 110, Tempe, AZ 85284 % 480-893-1630 fax: 480-893-1632 E-mail:
adrienne@finetechusa.com Web:
www.finetechusa.com
See at APEX Booth #1940.
strip tape, stick and matrix trays. The SP700avi Automatic Screen
Printer was designed to cope with the rigors of high-volume SMT production while incorporating the flexibility
XPii autoplacer.
needed in high-mix, quick product set- up and changeover environments. It comes fully equipped with automatic rail width adjust, auto stencil loading and a fully programmable Under Stencil Cleaner. Contact: Europlacer, 5804
Breckenridge, Suite E, Tampa, FL 33610 % 813-246-9500
See at APEX Booth #1073.
Finetech: Core Rework
System Tempe, AZ — Finetech’s Fineplacer° core rework system offers proven rework technology for a wide spec- trum of SMT components, ranging in size from 0201 to 70 x 70mm BGAs, and handling PCBs up to 300 x 400mm. The semi-automated design includes force measurement with automatic component lift-off and placement.
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