This page contains a Flash digital edition of a book.
Page 106


hi-TeCh evenTS www.us- tech.com


APEX Shows Industry Leaping out of Recession


Bannockburn, IL — Papers being presented at this year’s IPC APEX EXPO® Technical Conference, April 12-14, 2011 at the Mandalay Bay in Las Vegas include new research and innovations from industry experts around the world. The Technical Conference will cover more than 30 technical topics to provide the indus- try with practical solutions and new opportunities for the future. Over two-and-a-half days, 35 sessions with nearly 100 research papers will be presented on topics such as counter- feiting, lead-free reliability, embedded devices, environmental issues, high speed/RF, moisture and laminates, solar power, and sustainability.


In addition, soldering processes,


head-on-pillow defects, design, relia- bility and stencil printing are the sub- jects of multiple sessions because of the wealth of new information avail- able. “Lead-free processes and higher temperatures continue to challenge the industry on a number of fronts. One of the great advantages of IPC APEX EXPO is the chance to network and find solutions from multiple levels of the supply chain,” says IPC Technical Conference Director Greg Munie, Ph.D.


Management Council Before the action on the show


floor begins, senior-level executives EDS Scheduled for Las Vegas


Chicago, IL — Registration for EDS 2011 in now open for the show which meets from May 24-26 at the Paris Hotel and Balley’s in Las Vegas. This year marks an evolutionary change for an event that has been a staple of the electronics industry for over 70 years. Sponsored by ECA, ERA and NEDA, this is North America’s pre- mier networking marketplace for manufacturers, distributors and reps. The conference floor has been


reinvented this year to make it even more convenient for doing business. The industry meeting kicks off with an exciting and new reception on Monday, May 23rd from 4:30 pm until 6pm. With entertainment, food and


beverages, it’s a fun way to reconnect with valued associates, meet some new faces, and possibly walk away with some high-end electronics. Thousands of the industry’s


movers and shakers from around the world will attend EDS 2011, building business relationships. Take advan- tage of this cost-effective meeting to introduce your business’ newer stars to many industry leaders and help them establish important contacts. The entire three-day event is dedi- cated to helping grow your business. Contact: EDS, 222 S. Riverside


Plaza, Suite #2160, Chicago, IL 60606 % 312-648-1140 Web: www.edsconnects.com


2011 EDIToRIAL CALENDAR   


 


 


 


  


 


 


 


  





 


 


  


 


 


   


  


 


  


PP= Product Preview 


      


 


  


   


   


    


 


  


   


   


    


 


of PCB and EMS companies will meet to discuss industry challenges at the PCB Executive Management Meeting and EMS Management Council Meeting on April 11. Focused on providing executives with key information to successfully navigate today’s business environ- ment, these full-day meetings are rare opportunities for executives to hear from industry experts and to network with peers, suppliers and customers. Both meetings will be held in conjunction with IPC APEX


EXPO in Las Vegas and will con- clude with a VIP networking dinner boasting Apple co-founder Steve Wozniak as a guest. To kick off the PCB Executive


Management Meeting, Isola Chair - man and CEO Ray Sharpe will address attendees with a view of the PCB market from a laminator’s per- spective. During “Bridging the Gap Between Design and Fabrication,” a panel of fabricators, designers and suppliers will share insights on how


Continued on page 104


Trade Show Calendar MORE SHOWS: www.topline.tv/tradeshows.cfm


Apr. 5-6, Printed Electronics & Photovoltaics Europe. *Dusseldorf Congress Center, Dusseldorf, Germany. Contact: Web: www.IDTechEx.com/peEUROPE


Apr. 12-14, , IPC APEX. *Mandalay Bay Hotel & Convention Center, Las Vegas, NV. Contact: IPC % 877-472-4724 or 847-597-2860 (outside U.S. & Canada) Web: www.ipc.org or www.IPCAPEXEXPO.org


May 3-5, SMT/HYBRID/PACKAGING. *Nuremburg Trade Fair Center, Nuremberg,


Germany. Contact: Kallman Associates, Inc., 20 Harrison Avenue, Waldwick, NJ 07463-1709 % 201-652-7070 fax: 201-652-3898 E-mail jerry@kallmanexpo.com


May 3-6, International Conference on Soldering and Reliability, Co-located with Lead-Free Academy & SMTA Toronto Expo. *Crowne Plaza Toronto Airport Hotel in Toronto, Ontario, Canada. Contact: SMTA, 5200 Willson Rd., Suite 215, Edina, MN 55424 952-920-7682 fax: 952-926-1819 Web: www.smta.org


May 11-12, It’s Not Easy Being Green: Roadmap to Compliance *Hilton Back Bay Hotel, Boston, MA. Contact: IPC % 877-472-4724 or 847-597-2860 E-mail: registration@ipc.org Web: www.ipc.org or www.ipc.org/green-symposium-registration


May 17-19, EASTEC. *, Eastern States Exposition, West Springfield, MA. Contact: SME, One SME Drive, Dearborn, MI 48121 % 800-733-4763 or 313-271-1500 fax: 313-271-2861 Web: www.easteconline.com


May 18-19, 2011, Electrical Wire Processing Technology Expo. *Frontier Airlines Center, Milwaukee, WI. Contact: Expo Productions % 800-367-5520 or 262-367-5500 Web: www.epishows.com


May 24-25, EDS. *Paris & Bally’s Hotels, Las Vegas, NV. Contact: EDS, 222 South Riverside Plaza, Suite 2160, Chicago, IL 60606 % 312-648-1140 fax: 312-648-4282 E-mail: eds@edsc.org Web: www.edsc.org


June 7-9, Atlantic Design/MD&M East, Automation Technology Expo (ATX) East, EastPack, PLASTEC East, and Green Manufacturing Expo. * Jacob Javits Convention Center, New York, NY. Contact: Canon Communications LLC, 11444 West Olympic Blvd., Los Angeles, CA 90064 % 310-445-4200 fax: 310-445-4299 Web: www.cancom.com


June 15-16, IPC Summit on American Competitiveness, combined with Capitol Hill Day. *Washington, DC. Contact: IPC % 877-472-4724 or 847-597-2860 E-mail: registration@ipc.org Web: www.ipc.org


June 20-23, Energy Harvesting & Storage Europe/Wireless Sensor Networks & RTLS Europe. *Holiday Inn Munich City Center, Munich, Germany. Web: www.IDTechEx.com/Munich


July 12-14, Semicon West. *Moscone Center, San Francisco, CA. Contact: Semicon % 408-943-6973 or 408-943-6901 Web: www.semi.org


Sep. 19-21, IEEE Autotestcon. *Baltimore Convention Center, Baltimore, MD. Contact: www.autotestcon.com


Sept. 20-22, Electronics Midwest/IPC Midwest. *Stephens Convention Center, Rosemont, IL. Contact: Canon Communications, 11444 W. Olympic Blvd., Los Angeles, CA


90064-1549 %310-445-4200 fax: 310-996-9499 Web: http//www.canontradeshows.com or IPC % 877-472-4724 or 847-597-2860 Web: www.ipc.org


 


April, 2011


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108  |  Page 109  |  Page 110  |  Page 111  |  Page 112