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April, 2011 Mirtec AOI Gets New Vision Systems
Oxford, CT — Mirtec is showing its complete line of AOI and SPI (Solder Paste Inspection) systems, including its MV-7xi system configured with the
exclusive 15MPixel ISIS Vision System and proprietary 3D AOI tech- nology. The company is also showing an MV-7xi In-Line AOI System con-
figured with one Top-Down View 10MPixel camera with a precision 13.4µ telecentric compound lens and four 10MPixel side-view cameras. The company’s patented “Quad
Angle Lighting System” provides four independently programmable zones for optimal illumination of inspection areas. The MV-7xi on display incorpo- rates a 2D camera bar code reader, a high-throughput, three-stage PCB conveyor and a PCB under-board sup- port system. The system also will be configured with the company’s exclu- sive Intelli-Scan Laser System. This advanced technology offers superior lifted lead detection for gull wing devices, four-point height measure- ment capability for co-planarity test- ing of BGA and CSP devices, and enhanced solder paste measurement capability. A comprehensive package type library provides simple drag and drop component programming. The Automatic Teaching Tool (ATT) soft- ware provides automatic teaching of component locations using CAD cen- troid data. The Mirtec MS-11 In-Line SPI
System uses shadow free moiré phase-shift imaging technology for post screen print inspection of solder paste deposition on PCBs. The MS- 11 will inspect for: insufficient sol- der, excessive solder, shape deformi- ty, shift of deposition and bridging. The MS-11 is being newly configured with the 15MPixel ISIS Vision System for enhanced image quality, superior accuracy and lightning-fast
inspection rates. The MS-11 uses the same robust platform as the compa- ny’s MV-7 Series. Inspection heads are interchangeable between the two systems, adding ultimate flexibility to the inspection process. The company is also presenting
MS-11 SPI uses phase-shift imaging.
its total quality management system software, “Intellisys”. The software suite promotes continuous process improvement by allowing users to track and eliminate defects on inspected assemblies. Intellisys also provides remote debugging and moni- toring of up to eight production lines, allowing Mirtec customers to further maximize the efficiency of the inspec- tion process. Typical programming time is under one hour per assembly. Contact: Mirtec Corp., 3 Morse
Rd. #2A, Oxford, CT 06478 % 203-881-5559 fax: 203-881-3322 Web:
www.mirtecusa.com
See at APEX Booth #1925.
R&D Intros Updated Vapor Phase Reflow
See us at APEX Booth 2461
Burnsville, MN —Vapor phase manu- facturer R&D Technical Services Inc. is introducing its updated RD1 Batch Type Vapor Phase Reflow System. The RD1 uses vapor phase technology to provide consistent, uniform heat
Solder Bump Reballing System -M
for CSP and BGA SB2
Solder Bump Rework System Exceptional Features
• High-speed solder jetting for lead-free, eutectic SnPb, high lead, and AuSn.
• Rapid solder removal (optional) • High solder joint reliability due to low IMC growth through short laser reflow • Tin whisker control
• Solder ball sizes: 150µm and higher • Wafer-level CSP and BGA substrates
Booth 2218
ISO 9000 Certified
328 Martin Avenue • Santa Clara, CA 95050 T: 408-588-1925 • F: 408-588-1927 • Email:
Sales@PacTech-USA.com www.pactech.com See us at APEX Booth 2218
Visit us at APEX
Vapor phase reflow oven.
sion of the company’s patented pal- letized conveyor system that keeps the product horizontal throughout the process. The system has touch screen controls, a convected preheat zone, programmable recipes, a cool- ing zone, and a working fluid auxil- iary tank and filter system. Contact: R&D Technical
Services, Inc., 12261 Nicollet Ave. South, Suite A, Burnsville, MN 55337 % 952-707-1931 E-mail:
sales@rdtechnicalservices.com Web:
www.rdtechnicalservices.com
See at APEX Booth #2635.
transfer for high quality reflow, cur- ing and drying. The advanced reflow system was designed to accommodate low-volume production and smaller sized products. In addition, the RD1 delivers user-friendly operation and excellent process control — providing the perfect marriage of convected and vapor phase technologies. The unit allows any company, regardless of size, to produce products of the high- est quality. The updated reflow system has
a working envelope of 12 x 10 x 2.25- in. (305 x 254 x 57mm) using a ver-
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