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tech.com
April, 2011
ElEctronic Mfg SErvicES At PFC Flex Is King
By Steve Kelly, President, PFC Flexible Circuits Ltd, Scarborough, ON, Canada
manufacturing industry. Today’s sophisticated packaging require- ments require complex electrical and mechanical
F interfaces. Flexible
Printed Circuits provide a preferred electrical connection while simplify- ing the ever-increasing mechanical challenges. Miniaturization is con- tinuing to demand increased per- formance of each component. Few products other than Flexible Printed Circuits can provide mechanical and electrical interfaces in a cost-effec- tive solution within small packages. The application and configurations using Flexible Printed Circuits are limited only by the designer’s innova- tion. But for flex circuits to perform the way their designers intend, means a total design and manufac- turing package — from the ground up — a package that includes not only the flex substrate and its circuits, but virtually every minuscule component that is attached to it. Flexible printed Circuit assem-
bly is much different than assem- bling a printed circuit board. PFC has developed unique processes over the last 13 years that make the
lexible printed circuits repre- sent one of the fastest-growing segments of today’s electronics
all resulting in fewer surprises and critical supplier assumptions. Documentation requirements. Complete documentation packages are required to insure manufactura- bility, testing parameters, assembly instructions, and technical require- ments. This requires a tight commu- nication link between PFC and its customers. Document packages
should include: l
l Mechanical drawings. l Gerber files. l Drill files.
Assembly drawings. l l Bill of materials.
Specifications and quality requirements.
Surface mount line. assembly process predictable.
Starting with circuit design, materi- als, panel layout, temperatures, com- ponent placement requirements and oven flow — all are critical factors in creating an assembly that works the first time.
Cost of Ownership When analyzing the commercial
aspects of having a flex designed, a
flex built, and a flex assembled — and using two to three different sub- contractors — there are many hidden costs to consider. Handling issues, logistic management, com ponent mark-ups, lead time considerations, shipping costs and miscommunica- tion all must be factored into decid- ing how to get a flex delivered in a cost-effective manner. Technically, material considera-
tions, temperature variances, assem- bly techniques, component tolerances, test parameters and overall owner- ship of the design and product can cre- ate havoc for any company looking for an electronic interconnect device. PFC provides an overall lower cost of own- ership and ultimately “Flexcertainty” by providing all services under one roof.
Design to Deliver There is always the potential
for improvement in the process of product development and eventually the time to market. As a manufactur- er of flexible circuits, PFC actively advocates that customers and prospects utilize the company’s expertise in the early stages of devel- opment to assist in creating a build- able, producible, and repeatable solu- tion. The upfront assistance saves the customer both time and money in the long run. We call this concept “design to deliver”. Understanding the application
is key to a solid design. Interconnect parameters, mechanical considera- tions, product environments, signal speeds, and shielding are key to design and cost parameters. Early involvement and documenting of multiple options along with their advantages and weakness is critical to prevent wasted time and costly choices which are often not the best practice or best fit for the fabrication or the end application. Costing can be started at the con-
cept stage and can also be a measure of progress along the production path. The more information and the better the quality of the information, the more reliable are the cost estimates —
Tooling. The quantity, delivery, and estimated annual usage all impact the fabrication methodology and tool- ing approach. Pricing targets prevent a fine Cadillac from being designed for a short-run market that really wants a Smart car. If within this package one or more items are miss- ing, the opportunity for error arises; a clean package will again result in fewer surprises.
Flex Production PFC’s flexible printed circuit
manufacturing capabilities include single-sided, double-sided, multilay- er flex, and rigid flex to 18 layers. Specialty designs include fine line capabilities (2mil and below lines and spaces); impedance controlled flex; high-speed circuits; sculptured circuits and flex heaters. Additional
Hand soldering components on a rigid flex.
specialities include unique alloy capabilities and silver epoxy shield- ing. While PFC does not emphasize box-build capabilities, some 70 per- cent of its customers are provided a fully assembled solution.
PFC Assembly Capabilities The company provides flexible
printed circuits with electronic assembly — surface mount, through- hole and sub-assemblies. Capabil - ities include installing connectors, resistors, and capacitors — accommo- dating packages that are 01005, 0201, CCGA, COB, MCM, MEM, BGA and µBGA, Chip Scale Package (CSP), fine and ultra fine pitch high pin count connectors (12mil pitch), flip chips, SOIC, TSSOPBGA, and leadless packages. Recently PFC completed a major in-house expansion of its sec-
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