Page 8
www.us-tech.com
June, 2021
When the Chips are Down: Managing the Semiconductor Shortage
Continued from page 6
products where they can. Over the previous shortage cycles that the electronic component indus- try has endured, the commodity type products have been general- ly hit hardest, so having multiple sources on a bill of materials (BOM) helps. Finally, customers should
make sure to partner with compa- nies like Digi-Key, that invest in inventory and view the product they keep on-hand as an asset, not a liability. Partnering with a dis- tributor that can manage spikes in demand is essential.
Digi-Key has also developed
a suite of digital solutions to help customers integrate technology and a digital strategy for faster communication and better use of data for planning and procure- ment. Digi-Key provides three robust digital solutions including API, EDI and punchout, which help customers to maximize effi- ciency and speed, and improve operations through automation. Contact: Digi-Key Electron-
ics, 701 Brooks Avenue South, Thief River Falls, MN 56701 % 216-681-6674 E-mail:
sales@digikey.com Web:
www.digikey.com r
New Techniques for Flexible Printed Electronics
Continued from page 1
and easily scalable. “PE offers many advantages
High Performance Chemistry for Advanced Technologies
over conventional lithography- based technologies,” says Hamed Abdolmaleki, Ph.D. student and first author of the paper. “It opens up a plethora of new possi- bilities to print flexible electrical circuits directly onto a wide range of substrates, such as plas- tics, paper, clothes, and literally any other planar and nonplanar surfaces.” For Agarwala, the field is al-
so important in its benefits to the environment and its sustainabil- ity. In the paper, the team also describe the emerging field of en- vironmentally friendly sub- strates that have the potential to eliminate much of today’s issues with electronic waste. “PE is the way toward biodegradable elec- tronics,” she says. “Now, we can address the huge societal prob- lem that electronics present, which will only become more pressing in the future. The world
Pallaspeed® 990 Pure Palladium deposit for high-volume electronic applications.
• High Ductility/Low Stress • Bright Deposit • No Microcracking • Neutral pH • Wide Current Density Range • Superior Corrosion Resistance
is suffering from a huge amount of plastic pollution and burdened by the remains of discarded elec- tronics.”
Professor Shweta Agarwala holds a flexible electronic sheet.
Web:
www.international.au.dk r
UMC Plans $36 Billion Fab Expansion
Continued from page 1
cure enough chips from other manufacturers, such as TSMC and SK Hynix. TSMC reported recently that it plans to invest $100 billion USD in new capacity over the next three years. Intel has also announced plans to cre- ate a competing contract chip- making service. “There is a supply-demand
Learn more about Technic’s industry-leading plating technologies for tin, nickel, gold, silver and palladium at
www.technic.com
imbalance in mature nodes,” says Liu Chi-tung, UMC’s chief financial officer. “We have seen lots of capacity expansion in ad- vanced nodes, but companies have not addressed the mature nodes. There are lots of critical components on those nodes.”
All across the industry de-
mand is higher than expected, worsened by the global pandemic and is expected not to improve until at least next year. DRAM chip supplies are expected to re- main tight, but NAND memory chips may see a slightly faster recovery in both demand and price.
While the UMC deal, among
other investments, is aimed at battling the shortage, these ef- forts are likely to take around two years to take shape, high- lighting the depth of the current constraints on the semiconductor supply chain. Web:
www.umc.com r
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76
