June, 2021
www.us-tech.com
Page 33
Automated Inline Vapor Phase Soldering from Rehm Thermal Systems
ROSWELL, GA — Rehm Thermal Systems has introduced an all-around soldering sys- tem for electronics manufacturing. The Con- densoXM smart is a vapor phase soldering system that can be incorporated into an SMT line for mid-throughput applications. Rehm’s Condenso series of soldering sys-
tems allow even large, high-mass boards to be processed reliably in a stable atmosphere. In vapor-phase soldering (condensation sol- dering), soldering is accomplished using a hot vapor. In this case, the heat transfer in condensation soldering is up to ten times higher than that of convection soldering. The CondensoXM smart vapor-phase
soldering system can be integrat- ed into any production environ- ment. It may be incorporated as a standalone solution for several
Henkel Develops Bio-Based PUR Hot Melt Adhesive
IRVINE, CA — Henkel Corpora- tion has introduced, reportedly, the industry’s first bio-based polyurethane reactive (PUR) hot melt adhesive for consumer elec- tronics assembly, branded LOC- TITE® HHD 3544F. A one-part, moisture-cure
material, LOCTITE HHD 3544F delivers a sustainable consumer electronics assembly alternative that provides many of the advan- tages associated with the mar- ket-leading family of Henkel PUR hot melts. The bio-based formulation is
compatible with a variety of sub- strates including plastics, metals and glass; aligns with high-vol-
production areas and loaded manually or loaded automatically using upstream han- dling systems. It is also equipped with an outer return transport for the goods carrier. As an option, it can be outfitted with an
additional vacuum pump. This increases the reliability of the process when used for mis- sion-critical electronics that demand more of
the vacuum process. Contact: Rehm Thermal Systems, LLC,
CondensoXM smart vapor phase soldering system.
3080 Northfield Place, Suite 109, Roswell, GA 30076 % 770-442-8913 fax: 770-442-8914 E-mail:
c.kramer@
rehm-group.com Web:
www.rehm-group.com
LOCTITE HHD 3544F PUR adhesive.
ume production objectives, en- abling deposition of narrow bond lines via jetting or needle dis- pensing; and integrates fluores- cence for inline automatic optical inspection (AOI). LOCTITE HHD 3544F can
be used for a wide range of con- sumer electronics structural bonding applications in mobile phones, laptops, tablets, wear-
ables, and accessories. Contact: Henkel Corp.,
14000 Jamboree Road, Irvine, CA 92606 % 714-780-2909 E-mail:
eva.laus@
henkel.com Web:
www.henkel.com
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