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www.us-tech.com ElEctronic Mfg Products
MVP Develops 3D AOI for Microelectronics
VISTA, CA — For die and wire bond inspection, Machine Vision Products’ (MVP) 900 Series, is
wire, the 900 Series offers in- spection with the highest accura- cy profiler or microscopic objec- tive.
Measuring wire positions, die
positions, die tilt, underfill, and surface inspection are all criteria of most microelectronics inspec- tion applications. MVP also pro- vides easy-to-use tools that allow the program to be generated for each of these requirements. The 900 Series provides ad-
MVP 900 Series 3D AOI system.
designed to provide the largest toolbox of capabilities for inspec- tion and metrology of assemblies. By providing the highest ac-
curacy, optics, lighting, and 3D techniques, microelectronics as- semblies can be inspected for de- fects and metrology. For wire in- spection, whether the applica- tion is the inspection of 18 µm gold wire or 50 µm aluminum
vanced inspection solutions for mi- croelectronics assemblies used in medical, aerospace, telecoms, com- puting, data, industrial, space, IoT, and commercial products. MVP’s AutoData tools can
provide full traceability. Options also allow for image archiving
and full variable data retention. Contact: Machine Vision
Products, Inc., 3270 Corporate
View, Suite D, Vista, CA 92081 % 760-438-1138 E-mail:
sales@visionpro.com Web:
www.visionpro.com
Compact Rotary Encoder from HEIDENHAIN
SCHAUMBURG, IL — With its small dimensions and high relia- bility, HEIDENHAIN’s new KCI/KBI 1300 series of inductive rotary encoders are made specif- ically to support compact servo- motors for collaborative and service robots. Each lightweight encoder includes a 1 in. (25 mm) hollow shaft and inductive scan- ning technology that makes it in- sensitive to contamination and magnetic fields. The encoder communicates
using a high-speed EnDat 2.2 in- terface, which also allows for ad- ditional information, such as temperature or diagnostics, to be communicated. The rotary en- coder kits consist of a scanning unit and a rotor. The kit can be offered in two different versions. One variant consists of a
graduated disk that is directly screwed onto the mating shaft. The other variant is a disk/hub assembly that is press-fitted onto the mating shaft. Applications
with collaborating robots include: contamination-resistant induc- tive circumferential scanning; compact height: connection to large hollow shafts with 1 in. (25 mm), compared to the external di- mensions: large mounting toler- ances: no calibration run for in-
Rotary encoders for robotics.
creased accuracy necessary; in- sensitivity to magnetic fields of up to 30 mT; connection of an ex- ternal temperature sensor: and a
purely-serial EnDat 2.2 interface. Contact: HEIDENHAIN
Corp., 333 E. State Parkway,
Schaumburg, IL 60173 % 847-519-4702 E-mail:
jdougherty@heidenhain.com Web:
www.heidenhain.us
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