Page 80
hi-TeCh evenTS
www.us-
tech.com IEEE AUTOTEST to See U.S. Military Once Again
Washington, DC — The HON Frank Kendall, Under Secretary of Defense, Acquisition Technology & Logistics, issued a guidance memorandum to all DoD departments and agencies on February 20, 2014 urging DoD com- mands “to give appropriate consider- ation to the importance of attendance at technical symposia and confer- ences that enhance communication between DoD acquisition profession- als and their industry counterparts.” This memorandum was issued to
attempt to restore some of the critical interchange that military and govern- ment officials conduct with their industry counterparts during atten- dance at select conferences and sym- posia such as IEEE AUTOTEST. In HON Kendall’s memorandum, he rec- ognizes that “the Department (of Defense) is the largest single employer of scientists and engineers in the United States. Maintaining profes- sional currency is an important part of this investment in human capital.”
HON Kendall further states, “Science and technology (S&T) conferences and symposia, at which technical data and information is exchanged, are poten- tially beneficial both for maintaining technical competence and for the pro- fessional development of DoD scien- tists and engineers.” IEEE AUTO TEST clearly falls
within this definition of the types of conferences and symposia that HON Kendall is urging DoD employees to attend, where there is a technical rela-
Benefits vs. Risks: Technology’s Future Effects Explored at Purdue Summit
West Lafayette, IN — Will the cur- rent explosive growth in technology bring unimagined benefits to society, or create unforeseen disasters? That’s the question that will be
examined as Purdue University hosts a day-long summit on the ben- efits and risks posed to society by rapidly advancing technologies. The Sept. 18 event is free and open to the public and includes a co-located sci-fi movie festival. Will superintelligent computers
hundreds of times smarter than humans help us solve difficult prob- lems such as the causes of cancer or climate change, or will they decide we’re all just raw materials they need to consume in order to expand? Will industrial robots free us
from mundane and poor-paying facto- ry jobs, or will they displace workers and trigger a world-wide depression? Will computer processors in
everyday products bring new, unimagined levels of convenience, or will they inform governments and
corporations of our every move and decision? Or both? These are the types of questions
to be discussed at an upcoming tech- nology summit at Purdue University, “Dawn or Doom: the New Technology Explosion.” The event will explore whether
technology is advancing faster than our ability to understand, regulate, or control it, and what can be done about this situation. Purdue Presi - dent Mitch Daniels says the univer- sity is holding the conference because there often isn’t enough said about the potential benefits and risks of the rapid growth of technology. “The arrival of super intelligent
machines is only a matter of time, and many experts believe it won’t be long. The range of possible outcomes runs from thrilling to terrifying,” Daniels says. “The questions raised are not merely technical, but social, political, economic, and philosophi- cal. It’s an ideal topic to engage a broad spectrum of our faculty, stu-
2014 EDITORIAl CAlENDAR ISSUE Jan/Feb March April/May EDITORIAL
Test & Measurement Electronics West/MDM PP
Production & Packaging APEX PP
SMT & Production SMT/Hybrid/PKG PP Nepcon China PP EDS PP
SHOW DesignCon Electronics West/MDM
APEC APEX
Electronics New England
Nepcon China Del Mar Electronics SMT/Hybrid/PKG EDS
MFG4
June July
August
Components & Distribution Test & Assembly
Semicon West/Intersolar PP
Production & Packaging Nepcon South China PP
September PCB & Test PCB West PP SMTAI PP ATX PP IMAPS PP
October
Components & Distribution Electronica PP SMTAI PP
Nov/Dec
Test & Measurement Electronics West/MDM PP
PP= Product Preview Nepcon South China
Autotestcon PCB West PP SMTAI
ATX Midwest IMAPS
The Assembly MDM Minneapolis Fabtech Electronica
Electronics West/MDM 8/26 - 8/28
9/16 - 9/18 9/24 - 9/26 9/29 - 10/1 10/1 - 10/2 10/14 - 10/16
10/27 - 10/29 10/29 - 10/30 11/4 - 11/6 11/11 - 11/14 2/10 - 2/12
Shenzhen, China
St. Louis, MO Santa Clara, CA Rosemont, IL Chicago, IL San Diego, CA
Rosemont, IL Minneapolis, MN Atlanta, GA
Munich Germany Anaheim, CA
Eastec
Wire Processing Tech IMS
Atlantic Design Semicon West/Intersolar DATE
1/28 - 1/29 2/11 - 2/13
3/18 - 3/20 3/25 - 3/27 3/26 - 3/27
4/22 - 4/24 5/6 - 5/7 5/6 - 5/8 5/6 - 5/8 5/13 - 5/15 5/14 - 5/15 6/2 - 6/5
5/6 - 5/8
6/10 - 6/12 7/8 - 7/10
LOCATION
Santa Clara, CA Anaheim, CA
Ft. Worth, TX Las Vegas, NV Boston, MA
Shanghai, China San Diego, CA
Nuremberg, Germany Las Vegas, NV Milwaukee, WI Tampa Bay, FL New York, NY
Hartford, CT San Francisco, CA
dents, and those outstanding think - ers who will be joining us from around the world.” The summit will feature lectures
by recognized leaders in science and technology, as well as a concurrent movie festival that will look at how science fiction and popular culture have examined similar issues. The event is co-sponsored by
Information Technology at Purdue and Purdue Convocations. Info: Web:
www.purdue.edu/
dawnordoom
tionship with data interchange that has suffered over the past two years. HON Kendall urges military
commands and government organi- zations to distribute the guidance memorandum throughout
their
organizations, and we provide the full guidance memorandum here to assist you in understanding that DoD military and government per- sonnel will be allowed to attend events such as conferences and sym- posia that meet the criteria, such as IEEE AUTOTEST. This year’s AUTOTEST (former-
ly AUTOTESTCON) is scheduled for Sept. 15-18, at the America Center Convention Com plex, St. Louis, MO. Info:
www.ieee-autotest.com
Editor’s note: We attended the
2012 Autotestcon at Anaheim’s Disney land Hotel, and the show was very sparsely attended. There were zero U.S. military personnel in atten- dance due to a travel allowance cut- back by DoD at that time. The only uniforms visible were from foreign governments, and very few of those. It was a travesty, and it’s good to see that DoD has finally come to its sens- es regarding this issue.
Trade Show Calendar MORE SHOWS:
www.topline.tv/tradeshows.cfm
Aug. 26-28, NEPCON South China. *Shenzhen Convention and Exhibition Center, Hall 1 and 6, Shenzhen, China. Contact: Web:
www.nepconsouthchina.com
Sept. 15-18, IEEE AUTOTEST (formerly Autotestcon). *America Center Convention Complex, St. Louis, MO. Info:
www.ieee-autotest.com
Sept. 18, “Dawn or Doom: the New Technology Explosion” Technology Summit. *Purdue University Campus, West Lafayette, IN. Web:
www.purdue.edu/dawnordoom
Sept. 29-Oct. 1, SMTAI. *Donald E. Stephens Convention Center, Rosemont, IL. Contact: SMTA, 5200 Willson Rd., Suite 215, Edina, MN 55424 952-920-7682 fax: 952-926-1819 Web:
www.smta.org
Oct. 1-2, New England Design-2-Part Show. *Royal Plaza Trade Center, Marlborough, MA. Contact: Design-2-Part Shows, P.O. Box 7193, Prospect, CT 06712 % 203-758-6663 Web:
www.d2p.com
Oct. 15-16, Southern California Design-2-Part Show.*Long Beach Convention Center,
Long Beach, CA. Contact: Design-2-Part Shows, P.O. Box 7193, Prospect, CT 06712 % 203-758-6663 Web:
www.d2p.com
Oct. 28-30, The Assembly Show.*Donald E. Stephens Convention Center, Rosemont, IL. Contact:
www.theassemblyshow.com
Oct. 29-30, Northwest Design-2-Part Show. *Portland Expo Center, Portland, OR. Contact: Design-2-Part Shows, P.O. Box 7193, Prospect, CT 06712 % 203-758-6663 Web:
www.d2p.com
Nov. 11-14, electronica. *New Munich Trade Fair Centre, Munich, Germany. Contact: Munich Trade Fairs, 75 Broad St., 21 Floor, New York, NY 10004 % 646-437-1014 Web:
www.munichtradefairs.com
Nov. 18-20, SEMI South America Semiconductor Strategy Summit. *Hilton
Buenos Aires, Buenos Aires, Argentina. Contact: SEMI, 3081 Zanker Rd., San Jose, CA 95134 % 408-943-6900 fax: 408-943-7914 Web:
www.semi.org or
www.semi.org/southamerica
Nov. 19-20, Southeast Design-2-Part Show.*State Fair Exposition Center, Raleigh, NC. Contact: Design-2-Part Shows, P.O. Box 7193, Prospect, CT 06712 % 203-758-6663 Web:
www.d2p.com
Dec. 8-12, IEEE Globecom 2014.*Hilton Austin, Austin, TX. Contact: IEEE Communications Society, Heather Ann Sweeney % 212-705-8938 E-mail:
h.sweeney@comsoc.org Web:
www.ieee-globecom.org/2014
Feb. 24-26, 2015, IPC APEX Expo. *San Diego Convention Center, San Diego, CA. Contact: IPC % 877-472-4724 or 847-597-2860 (outside U.S. & Canada) Web:
www.ipc.org or
www.IPCAPEXEXPO.org
Apr. 21-23, 2015, NEPCON China. *Shanghai World EXPO Exhibition & Convention Center, Shanghai, China. Web:
www.nepconchina.com
August, 2014
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84