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August, 2014


Implementing Warpage Management: A Five-Step Process for EMS Providers


electronics components as they change throughout the reflow assembly process. Leading semiconduc- tor manufacturers have had warpage management systems in place for ten years or more, mainly because microchip package warpage must be under- stood and compensated for in order to attain high assembly yields. Similarly, newer device architec- tures such as package-on-package and system-on-a- chip are sensitive to warpage-related assembly issues, and companies involved in the manufacture and assembly of these devices tend to have the most advanced warpage management programs. Managing warpage is important not only for


W


those who manufacture components, but also for those manufacturing products by means of a reflow assembly process. Some electronics manufacturing services (EMS) providers involved with the most complex, thinnest, most mission-critical electronics products have already implemented warpage man- agement systems out of necessity. Akrometrix (www.akrometrix.com) has advised and assisted several of these companies, in creating protocols that help them understand, monitor, compensate for, and correct warpage-related issues and provide high-quality, high-reliability products to their cus- tomers. Creating a warpage management program for EMS providers can be summarized as a five-step process:


l l l


Understand the relevant standards.


Plan to share data with customers and supply-chain partners.


Choose the required equipment and personnel to be trained.


Warped boards or packages can lead to a


number of problems during circuit assembly, including stretched joints and opens.


Akrometrix is in a good position to advise on


managing warpage. The original technology for measuring electronics components in a simulated reflow environment was invented in the early 1990s by a team at Georgia Institute of Technology led by Dr. Charles Ume. That team became a com- pany called Electronics Packaging Services (EPS), focused on meeting urgent semiconductor industry requests for component warpage measurements. In 1994, EPS became Akrometrix LLC. The high volume of testing services needed by cutting-edge electronics innovators led to the development and release of the firm’s first TherMoiré equipment products for warpage testing. The testers use patented shadow moiré and phase-stepping tech-


arpage management consists of planning, measuring, analyzing, sharing, and react- ing to data related to the surface shapes of


By Ken Chiavone, Vice-President of Engineering, Akrometrix LLC, Atlanta, GA l Implement best practices.


l


Learn from ongoing data collection and analysis.


nologies to provide three-dimensional (3D) full- field, high-resolution information about the shape of electronics components as they progress through a reflow cycle. The first TherMoiré measurement system


was installed in Berlin, Germany in 1998. Hundreds of systems are now in use throughout the global electronics supply-chain network. In addition to shadow moiré technology, a TherMoiré system features “modular metrology” capabilities, allowing other technologies, such as digital image correlation (DIC) for surface strain, and digital fringe projection (DFP), to be used interchangeably inside a common TherMoiré hardware and soft- ware platform. Still, the system’s shadow moiré technology still provides the best combination of high-speed, high-resolution measurement capabil- ities at elevated temperatures, and delivers accu- rate full-field 3D warpage results for any meas- ured area. The five key steps in the warpage man- agement process provide an outline for companies wanting or needing to implement any program involving warpage data. And Akrometrix engi-


TherMoiré provides “modular metrology” capabilities, allowing other technologies, such as digital


image correlation (DIC) for surface strain, and digital fringe projection (DFP), to be used interchangeably.


neers are in a unique position to help companies implement such programs in as basic or advanced forms as needed. The first step in developing a warpage man-


Continued on next page


THERMAL INTERFACE MATERIALS HIGH PERFORMANCE & LOW COST OPTIONS FROM 1 to 17 Watt/M-K!


Gap Filler Pads G


Thin Films


G


Greases


Putty


Form-In-Place


Die-Cuts C


Extrusions


Non-Silicone S


For Technical Data, Samples, Engineering Support - Get Our Catalog, Visit Our Site www.fujipoly.com or Call 732.969.0100


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